SFM-143-02-SM-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-143-02-SM-D-A-P is an 86-position dual-row surface-mount socket strip with 0.050" (1.27 mm) pitch, engineered for high-reliability board-to-board and mezzanine stacking applications. The horizontal SMT termination style supports automated reflow assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 86
- Lifecycle
- ACTIVE
- Datasheet
- SFM-143-02-SM-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-143-02-SM-D-A-P?
- 86-position dual-row layout at 0.050" (1.27 mm) pitch delivers ultra-high signal density per connector
- Surface-mount termination for fully automated SMT reflow assembly without through-hole drilling
- High-reliability construction with gold-plated contacts rated for hundreds of mating cycles
- Compliant with standard PCB footprint conventions enabling drop-in replacement in mezzanine designs
What is SFM-143-02-SM-D-A-P used for?
The SFM-143-02-SM-D-A-P is designed for high-density board-to-board and mezzanine stacking in embedded computing modules, network line cards, and FPGA daughter card assemblies. The 86-position dual-row format supports routing of data, power, and control signals across a single connector interface. It is widely used in server backplane expansion cards, military embedded computing, and high-speed communications equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-143-02-SM-D-A-P datasheet?
SFM-143-02-SM-D-A-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-143-02-SM-D-A-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does the SFM-143-02-SM-D-A-P provide and how are they arranged?
The SFM-143-02-SM-D-A-P provides 86 total positions arranged in a dual-row configuration with 43 positions per row, all at 0.050 inch (1.27 mm) pitch. This high-density layout allows routing of many data, power, and control signals through a connector with a board footprint under 60 mm in length.
For a high-speed FPGA mezzanine card design, how does SFM-143-02-SM-D-A-P enable a compact interface?
The SFM-143-02-SM-D-A-P's 1.27 mm pitch packs 86 signals into a very small SMT footprint, making it ideal for FPGA mezzanine cards where routing density is critical. Its surface-mount profile eliminates through-hole vias, freeing up additional routing layers on the base PCB for high-speed differential pairs and power planes.
What makes SAMTEC SFM series connectors suitable for high-reliability applications?
SAMTEC SFM series connectors feature gold-plated contacts and robust housing materials rated for operating temperatures from -55°C to +125°C, ensuring consistent electrical performance in harsh environments. The high-reliability designation indicates the connectors are built to withstand repeated mating cycles and mechanical shock, suitable for defense, aerospace, and industrial computing platforms.
Can the SFM-143-02-SM-D-A-P be assembled using standard SMT production lines?
Yes, the SFM-143-02-SM-D-A-P uses surface-mount termination compatible with standard pick-and-place equipment and reflow soldering profiles. The SM designation in the part number confirms the SMT footprint, and the non-tape-and-reel version ships in trays or cut-strip packaging for prototype and low-to-medium volume production runs.
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