SFM-143-02-F-D-A SAMTEC Connector (Other) In Stock
The SFM-143-02-F-D-A is a high-reliability 86-position dual-row surface-mount socket strip from SAMTEC on a 0.050 inch (1.27 mm) pitch. Designed for high-density board-to-board and mezzanine interconnects, it supports automated SMT assembly and delivers consistent signal integrity. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 86
- Lifecycle
- ACTIVE
- Datasheet
- SFM-143-02-F-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 86-position dual-row SMT socket strip on tight 0.050 inch (1.27 mm) pitch for high pin-count board-to-board connections
- High-reliability contacts rated for robust mating cycles, maintaining low contact resistance across the full operating temperature range
- Surface-mount termination enables automated pick-and-place reflow assembly, reducing production cost in volume manufacturing
Applications
The SFM-143-02-F-D-A is used in mezzanine card interconnects, FPGA expansion modules, and embedded computing boards where 86 reliable signal contacts are required at 0.050 inch pitch. Its surface-mount design suits high-density daughter-card and backplane applications in industrial automation, test equipment, and telecom line cards. The dual-row arrangement maximizes contact density per unit of board length, making it ideal for compact module-to-module signal routing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the SFM-143-02-F-D-A provide, and how are they arranged across its rows?
The SFM-143-02-F-D-A is an 86-position connector arranged in 2 rows of 43 contacts each, spaced at a 0.050 inch (1.27 mm) pitch. This dual-row layout delivers high contact density in a compact surface-mount footprint, making it suitable for high-speed data bus and dense I/O applications on constrained PCBs.
For which high-density interconnect scenarios is the SFM-143-02-F-D-A best suited compared to through-hole socket strips?
The SFM-143-02-F-D-A's surface-mount termination is preferred over through-hole designs when PCB routing space below the board is limited, such as in stacked mezzanine modules or compact SBCs. SMT pads eliminate the need for drilled vias at each of the 86 pin locations, freeing inner PCB layers for signal routing and reducing total board thickness in multilayer designs.
What pitch does the SFM-143-02-F-D-A use, and how does 0.050 inch pitch affect the mating connector selection?
The SFM-143-02-F-D-A uses a 0.050 inch (1.27 mm) pitch. This is the standard pitch for SAMTEC's SFM and SFS connector families, so mating headers such as SAMTEC's TSW or SSQ series at the same 1.27 mm pitch are required. Using the correct pitch ensures proper pin alignment across all 86 positions and prevents damage during mating.
When should a designer choose the SFM-143-02-F-D-A over a 144-position SFM-144 variant for a daughter-card design?
A designer should select the SFM-143-02-F-D-A (86 pins) over the SFM-144 (144 pins) when the daughter card's interface bus uses 86 signals or fewer, since over-specifying contact count adds unnecessary PCB footprint length at 0.050 inch pitch. Fewer contacts also reduce the mating insertion force, which matters in field-replaceable module designs where connectors may be mated manually dozens of times.
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