SFM-143-02-F-D SAMTEC Connector (Other) In Stock
SAMTEC SFM-143-02-F-D is an 86-position dual-row socket strip with 0.050" (1.27 mm) pitch in surface-mount configuration. It offers high-reliability signal interconnects rated at 1.0 A per contact for dense board-to-board applications. Stocked globally with worldwide shipping available.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 86
- Lifecycle
- ACTIVE
- Datasheet
- SFM-143-02-F-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 86-position dual-row SMT socket strip at 0.050" (1.27 mm) pitch for very high signal density
- High-reliability contacts rated at 1.0 A per contact, supporting mixed digital and low-power supply lines
- Surface-mount construction with controlled-depth tail for consistent solder joint quality in reflow processes
- SAMTEC precision-stamped gold contacts deliver low insertion force and reliable mating cycles exceeding 200 cycles
Applications
The SFM-143-02-F-D is ideal for high-speed computing and FPGA mezzanine cards requiring 86 signals at 1.27 mm pitch in a compact SMT footprint. It is commonly deployed in telecommunications line cards and data acquisition boards where large pin counts must be accommodated within a limited board area. Its dual-row layout supports efficient routing of parallel buses in embedded system backplanes.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the SFM-143-02-F-D provide and what is its pitch?
The SFM-143-02-F-D provides 86 positions arranged in 2 rows with a 0.050" (1.27 mm) pitch. This high-density configuration allows routing of up to 86 separate signal or power lines within a surface-mount socket strip, making it suitable for FPGA mezzanine and similar large pin-count applications.
What current rating should designers use when specifying SFM-143-02-F-D for power distribution?
Each contact in the SFM-143-02-F-D is rated at 1.0 A continuous current. For power distribution across multiple pins, designers can bundle adjacent contacts to increase effective current capacity, a common practice in high-density mezzanine designs where several power and ground pins share a connector row.
Which board-to-board applications are best served by the SFM-143-02-F-D's 86-position configuration?
Applications such as FPGA daughter cards, high-speed data acquisition modules, and telecom line cards benefit from 86-position dual-row connectivity at 1.27 mm pitch. These use cases demand large pin counts in small areas, and the SMT footprint of the SFM-143-02-F-D integrates directly into reflow soldering processes without additional hardware.
How does the SFM-143-02-F-D compare to a similar SAMTEC connector with fewer positions for more cost-sensitive designs?
For cost-sensitive designs not requiring all 86 positions, SAMTEC offers SFM series connectors in smaller pin counts such as 20, 40, or 60 positions at the same 1.27 mm pitch. Selecting a smaller variant reduces board footprint and cost while retaining the same 1.0 A per contact rating and compatible mating interface, allowing scalable system design across product tiers.
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