SFM-142-T2-S-D SAMTEC Connector (Other) In Stock
Samtec SFM-142-T2-S-D is an 84-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch, engineered for surface mount applications requiring a very high contact count with precise mating alignment and robust PCB retention.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 84
- Lifecycle
- ACTIVE
- Datasheet
- SFM-142-T2-S-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 84-position dual-row (42x2) arrangement on 0.050" (1.27 mm) pitch delivers exceptional contact density for complex board-to-board interconnects
- High-reliability socket construction with SMT termination enables automated reflow soldering and stable long-term electrical performance
- Low-profile surface mount design supports mezzanine card and backplane applications in height-constrained system enclosures
Applications
The SFM-142-T2-S-D is well suited for large FPGA mezzanine cards, high-channel-count data acquisition boards, and communications backplane interconnects requiring 84 contacts at 0.050" pitch. Its surface mount format enables automated PCB assembly and consistent solder joint quality across all 42x2 contacts, reducing manufacturing defects in high-volume production. Network switching equipment, industrial machine vision systems, and medical imaging platforms benefit from the connector's combination of high pin count and reliable SMT attachment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the total contact count and row arrangement of the SFM-142-T2-S-D socket strip?
The SFM-142-T2-S-D provides 84 contacts arranged in a dual-row (42x2) configuration on a 0.050" (1.27 mm) pitch. This high-density layout is designed for FPGA mezzanine cards, data acquisition modules, and backplane interconnects where large numbers of signal and power contacts must be accommodated within a compact PCB footprint.
How does the SFM-142-T2-S-D's 0.050" pitch compare to standard 0.100" pitch options for a high-channel backplane design?
At 0.050" pitch, the SFM-142-T2-S-D fits 84 contacts into roughly the same board length that a 0.100" pitch connector would use for 42 contacts, effectively doubling signal density per millimeter. For high-channel backplane designs in rack-mount or embedded computing systems, this allows more I/O signals to cross a board edge without expanding the connector zone or adding additional connectors.
Is the SFM-142-T2-S-D suitable for reflow soldering, and what SMT profile is recommended?
Yes, the SFM-142-T2-S-D is designed specifically for surface mount reflow soldering and is compatible with standard lead-free SMT profiles up to 260°C peak temperature. Its 84-position SMT footprint ensures that all contacts are simultaneously soldered in one reflow pass, and the connector body is rated to withstand standard reflow without warping or contact displacement.
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