SFM-142-T2-FM-D SAMTEC Connector (Other) In Stock
SAMTEC SFM-142-T2-FM-D is an 84-position dual-row high-reliability surface-mount socket strip with 0.050" pitch for high-density board-to-board mating. It offers robust mating cycles and gold-plated contacts for stable signal integrity. Available through global SAMTEC distribution with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 84
- Lifecycle
- ACTIVE
- Datasheet
- SFM-142-T2-FM-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-142-T2-FM-D?
- 84-position dual-row surface-mount socket at 0.050" (1.27 mm) pitch enabling high-density mating with matching header connectors
- High-reliability contact design rated for extended mating cycles ensuring long service life in demanding telecom and industrial applications
- SMT footprint compatible with standard reflow soldering at up to 260°C enabling integration into automated PCB assembly lines
- Gold-plated contacts delivering low contact resistance and corrosion resistance for consistent signal integrity across the full 84-position array
What is SFM-142-T2-FM-D used for?
The SFM-142-T2-FM-D is designed for high-density board-to-board socket connections in telecommunications equipment, networking infrastructure, and industrial embedded computing systems. Its 84-position, 0.050" pitch SMT design enables mezzanine card attachment, daughter-board stacking, and backplane socket interfaces where high signal count and compact footprint are both required. Defense electronics and data acquisition systems also use this socket strip for its high-reliability contact design and repeatable mating performance.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-142-T2-FM-D datasheet?
SFM-142-T2-FM-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-142-T2-FM-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the position count, pitch, and mounting style of the SFM-142-T2-FM-D socket strip?
The SFM-142-T2-FM-D is an 84-position dual-row socket strip with a 0.050" (1.27 mm) pitch and a surface-mount (SMT) footprint. The dual-row layout distributes 84 contacts across two parallel rows, which reduces the connector's overall board length compared to a single-row design and allows for high-density signal routing in compact PCB layouts found in telecom and embedded computing platforms.
How does the SFM-142-T2-FM-D achieve high reliability across repeated mating cycles?
The SFM-142-T2-FM-D uses precision-formed contacts with gold plating and a spring-beam design engineered to maintain consistent normal force over thousands of insertions and extractions. This keeps contact resistance below 20 milliohms throughout the connector's service life and prevents intermittent opens caused by contact wear or oxidation. The high-reliability rating makes it suitable for field-replaceable modules and hot-swappable boards in networking and industrial applications.
Which PCB assembly process supports the SFM-142-T2-FM-D, and what reflow temperature does it tolerate?
The SFM-142-T2-FM-D is a surface-mount component compatible with standard SMT reflow soldering up to 260°C per IPC-J-STD-020. It can be placed using automated pick-and-place equipment and soldered in a single reflow pass alongside other SMT devices, simplifying board assembly. This compatibility with high-volume SMT processes makes it cost-effective for large production runs in telecom and computing hardware manufacturing.
What header connector family mates with the SFM-142-T2-FM-D in a board-to-board stack?
The SFM-142-T2-FM-D is designed to mate with SAMTEC's matching SFM-series headers or compatible 0.050" pitch dual-row pin headers, creating a reliable 84-position board-to-board interconnect with a mated height determined by the header stack height selection. This pairing supports stack heights from approximately 1.5 mm to over 15 mm, allowing system designers to set board separation based on component clearance requirements in multi-board enclosures and mezzanine card assemblies.
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