SFM-142-L2-SM-D-A-K SAMTEC Connector (Other) In Stock
The SFM-142-L2-SM-D-A-K is an 84-position dual-row surface-mount socket strip from SAMTEC with a 0.050" pitch, engineered for high-reliability board-to-board mating in demanding electronics applications. It provides low-profile SMT attachment with precision-formed contacts for consistent insertion force across all 84 positions. Available through global distribution for fast worldwide delivery.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 84
- Lifecycle
- ACTIVE
- Datasheet
- SFM-142-L2-SM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 84-position dual-row layout on 0.050" (1.27 mm) pitch delivering high pin density for compact board-to-board interconnection
- Surface-mount termination style eliminates through-hole drilling, simplifying PCB manufacturing in high-density assemblies
- High-reliability SAMTEC construction with precision-formed contacts ensuring consistent 84-pin mating force and low contact resistance
Applications
The SFM-142-L2-SM-D-A-K is optimized for board-to-board and mezzanine card interconnection in high-density embedded computing modules, FPGA daughter cards, and RF signal-processing boards where 0.050" pitch provides more than twice the pin density of standard 0.100" connectors. Its 84-position dual-row format supports simultaneous power and high-speed data lanes in compact server blades and test-and-measurement platforms. The surface-mount termination integrates seamlessly into automated SMT production lines without additional drilling or wave-soldering steps.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 0.050" pitch of the SFM-142-L2-SM-D-A-K compare to standard 0.100" connectors in terms of board space savings?
At 0.050" (1.27 mm) pitch, the SFM-142-L2-SM-D-A-K occupies roughly half the footprint of an equivalent 0.100" pitch connector for the same 84-pin count, freeing approximately 50% of connector area on crowded PCBs. This density advantage is critical for FPGA mezzanine cards, compact server blades, and portable instrumentation where every square millimeter of board space affects overall product dimensions.
Which high-reliability computing or test-and-measurement applications are best served by the SFM-142-L2-SM-D-A-K's 84-position layout?
The 84-position dual-row format suits FPGA daughter boards, DSP mezzanine cards, and VPX or COM Express module stacks that simultaneously route 3.3 V and 1.8 V power rails alongside dozens of high-speed differential pairs operating at 1 Gbps or faster. Telecom line cards and mil-aero mission computers also benefit from the high contact count, which enables full redundancy across parallel signal buses without requiring a second connector footprint.
What should procurement engineers verify when qualifying the SFM-142-L2-SM-D-A-K as a drop-in replacement for a competing 0.050" socket strip?
Engineers should confirm that the replacement shares the same 0.050" (1.27 mm) pitch, identical dual-row contact spacing of 0.050" between rows, the same overall body length for 42 positions per row, and compatible SMT land pattern dimensions to within ±0.05 mm. Contact current rating—typically 1 A per pin for 0.050" pitch—and mating connector height must also match to preserve the existing PCB stack-up clearance in chassis-mounted assemblies.
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