SFM-142-L2-FM-D SAMTEC Connector (Other) In Stock
SAMTEC SFM-142-L2-FM-D is an 84-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch optimized for surface mount assembly. It provides a dense interconnect solution for backplane and board-stacking applications requiring high pin counts. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 84
- Lifecycle
- ACTIVE
- Datasheet
- SFM-142-L2-FM-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 84-position dual-row socket strip with 0.050" (1.27 mm) pitch for ultra-high-density board interconnects
- Surface mount footprint enables automated PCB assembly with standard reflow soldering processes
- High-reliability construction supports demanding environments including industrial and defense electronics
- Compatible with SAMTEC SFM-series mating headers for a controlled-impedance matched connector pair
Applications
The SFM-142-L2-FM-D serves high-density board-to-board interconnect applications in backplane systems, FPGA development boards, and high-channel-count data acquisition modules. Its 84-position dual-row layout on a 0.050" pitch enables routing of over 80 differential or single-ended signals in a compact SMT footprint. Defense, industrial automation, and telecommunications equipment designers rely on it for reliable, high cycle-count mating in demanding environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and what pitch does the SFM-142-L2-FM-D offer?
The SFM-142-L2-FM-D provides 84 positions arranged in a dual-row layout with a 0.050" (1.27 mm) pitch, giving 42 contacts per row. This extremely high-density configuration allows designers to consolidate over 84 signal lines into a surface mount connector with a footprint far smaller than equivalent 0.100" pitch alternatives, reducing board area and improving routing efficiency.
For which types of board-to-board connections is the SFM-142-L2-FM-D best suited?
The SFM-142-L2-FM-D excels in backplane-to-daughter-card, mezzanine, and FPGA-to-I/O-expansion board connections where 84 signals must pass between PCBs in a compact assembly. Its 0.050" pitch dual-row SMT design is ideal for high-speed digital data buses, analog multiplexer inputs on 8-channel or 16-channel measurement systems, and any stacked-board architecture requiring reliable high pin-count interconnects.
What is the reflow compatibility and assembly process for the SFM-142-L2-FM-D?
The SFM-142-L2-FM-D is designed for standard SMT reflow assembly, compatible with lead-free solder profiles up to 260 °C peak temperature per IPC/JEDEC J-STD-020 guidelines. Its surface mount leads support solder paste stencil printing and automated pick-and-place placement, streamlining high-volume assembly for the 84-position footprint and ensuring consistent solder joint quality across all contacts.
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