SFM-142-L2-F-D-LC SAMTEC Connector (Other) In Stock
SAMTEC SFM-142-L2-F-D-LC is an 84-position dual-row high-reliability surface mount socket strip with 0.050" (1.27 mm) pitch and low-profile housing. Features lead-free construction and long contact retention for demanding board-to-board applications. Available with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 84
- Lifecycle
- ACTIVE
- Datasheet
- SFM-142-L2-F-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-142-L2-F-D-LC?
- 84-position dual-row layout at 0.050" (1.27 mm) pitch enabling high-density mezzanine and daughter card interconnects
- High-reliability socket strip construction rated for extended mating cycles in aerospace and defense applications
- Low-profile surface mount design (L2 stack height variant) reducing board-to-board separation to as little as 4 mm
- Lead-free (LC suffix) RoHS-compliant contacts supporting modern lead-free PCB assembly processes at up to 260°C
- F-type contact retention providing enhanced grip force for secure mating with corresponding TSM terminal strip headers
What is SFM-142-L2-F-D-LC used for?
The SFM-142-L2-F-D-LC is designed for high-density mezzanine board stacking in telecommunications equipment, FPGA compute modules, and aerospace electronics requiring 84 reliable signal positions at a compact 1.27 mm pitch. Its low-profile L2 variant minimizes board-to-board stack height while maintaining secure mechanical retention across all 84 contacts. The lead-free construction makes it suitable for modern RoHS-compliant manufacturing in defense avionics and industrial control platforms.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-142-L2-F-D-LC datasheet?
SFM-142-L2-F-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-142-L2-F-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the SFM-142-L2-F-D-LC provide for board-to-board stacking applications?
The SFM-142-L2-F-D-LC provides 84 positions in a dual-row (42 per row) configuration at a 0.050" (1.27 mm) pitch. This enables high-density signal routing between mezzanine cards and base boards, fitting 84 connections within a connector footprint of approximately 53 mm x 3 mm on the PCB surface.
How does the L2 stack height variant of the SFM-142-L2-F-D-LC benefit compact embedded system designs?
The L2 designation indicates a low-profile stack height that reduces the board-to-board separation to approximately 4 mm when mated with a corresponding TSM header. This compact mated height is critical for embedded computing modules, FPGA mezzanine cards, and wearable electronics where total board stack thickness must remain below 8 mm.
Is the SFM-142-L2-F-D-LC compatible with SAMTEC's TSM-142 mating header series?
Yes. The SFM-142-L2-F-D-LC is designed to mate with SAMTEC's TSM-142 dual-row terminal strip headers at 0.050" (1.27 mm) pitch. The mated pair provides 84 signal connections with a typical contact resistance below 20 mΩ per position, suitable for high-speed digital signals in FPGA and embedded processor daughter card designs.
For an FPGA development board requiring a high-density mezzanine connector, when would the SFM-142-L2-F-D-LC outperform a 2.54 mm pitch alternative?
When PCB routing space is constrained, the SFM-142-L2-F-D-LC's 1.27 mm pitch provides the same 84 signal connections as a 2.54 mm alternative but requires only half the connector body length (approximately 53 mm vs. 106 mm), freeing significant board area for power planes, decoupling capacitors, or additional I/O on a densely routed FPGA development board.
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