SFM-141-L2-S-D-A-K SAMTEC Connector (Other) In Stock
Samtec SFM-141-L2-S-D-A-K is a high-reliability 82-position dual-row surface-mount socket strip on a 0.050" (1.27mm) pitch, designed for board-to-board and mezzanine interconnect applications requiring dense signal routing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 82
- Lifecycle
- ACTIVE
- Datasheet
- SFM-141-L2-S-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 82-position dual-row layout on 0.050" (1.27mm) pitch enables high-density signal routing in compact PCB assemblies
- Surface-mount termination style supports automated reflow soldering for high-volume production
- High-reliability socket strip construction from Samtec's SFM series rated for demanding industrial and aerospace mezzanine interconnect applications
Applications
The SFM-141-L2-S-D-A-K is designed for high-density board-to-board and mezzanine stacking applications in embedded computing, aerospace, and industrial control systems where a large number of signals must be routed in a space-constrained layout. Its 82-position dual-row configuration on a 1.27mm pitch provides 164 contacts in a small PCB footprint, making it suitable for FPGA daughter cards, DSP modules, and backplane interconnects. The surface-mount package integrates into standard SMT assembly workflows without requiring through-hole drilling.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does the SFM-141-L2-S-D-A-K have, and what is its contact pitch?
The SFM-141-L2-S-D-A-K has 82 total positions arranged in 2 dual rows, giving 164 individual contacts on a 0.050-inch (1.27mm) pitch. This high contact density per unit length makes it one of the denser surface-mount socket strips in Samtec's SFM series, suitable for FPGA, processor, or DSP daughter-card interfaces that require many signal and power pins.
Which mezzanine or board-to-board stacking applications is the SFM-141-L2-S-D-A-K suited for?
The SFM-141-L2-S-D-A-K is suited for mezzanine board stacking in embedded computing, VME, and cPCI carrier-module designs, as well as FPGA and DSP daughter cards. Its 82-position dual-row layout accommodates high lane-count interfaces where 100+ signal connections must be made in a footprint under 55mm long, a common constraint in military, aerospace, and high-performance industrial computing modules.
Does the SFM-141-L2-S-D-A-K support standard SMT reflow assembly, and what solder profile is compatible?
Yes, the SFM-141-L2-S-D-A-K is a surface-mount component compatible with standard lead-free reflow solder profiles peaking at 260°C per IPC/JEDEC J-STD-020. The SMT termination style allows pick-and-place placement and reflow soldering in a single pass without hand-soldering through-hole pins, which reduces assembly cycle time for large boards with many mezzanine connectors.
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