SFM-141-L2-FM-D-A SAMTEC Connector (Other) In Stock
SAMTEC SFM-141-L2-FM-D-A is an 82-position dual-row surface-mount socket strip with 0.050-inch (1.27 mm) pitch, engineered for high-reliability mezzanine and board-to-board signal interconnects. The low-profile SMT footprint supports automated reflow assembly and high-cycle mating. Available from stock worldwide with fast global shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 82
- Lifecycle
- ACTIVE
- Datasheet
- SFM-141-L2-FM-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 82 positions in a dual-row, 0.050-inch (1.27 mm) pitch layout for dense signal aggregation
- Surface-mount termination compatible with standard reflow soldering and automated PCB assembly
- High-reliability contact system rated for multiple mating cycles in demanding environments
- Low-profile SMT body minimizing height above the PCB for compact stacked designs
- SAMTEC SFM series precision engineering ensuring consistent contact integrity across all 82 positions
Applications
The SFM-141-L2-FM-D-A is ideal for high-density board-to-board and mezzanine connector applications in embedded computing, telecommunications, and industrial instrumentation. Its 82-position, 1.27 mm pitch dual-row layout aggregates a large number of signals across a minimal PCB area using surface-mount reflow assembly. The connector is a strong fit for daughtercard, compute module, and FPGA expansion interfaces where signal density and reliable multi-cycle mating performance are both required.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does the SFM-141-L2-FM-D-A provide and how are they arranged?
The SFM-141-L2-FM-D-A provides 82 positions arranged in a dual-row configuration at a 0.050-inch (1.27 mm) pitch, with 41 contacts per row. This layout allows designers to carry up to 82 signal, power, or ground lines across a single compact 1.27 mm pitch connector, reducing the number of individual connectors required on a crowded PCB.
What SAMTEC mating header is compatible with the SFM-141-L2-FM-D-A for a stackable board design?
The SFM-141-L2-FM-D-A mates with SAMTEC TSM or TFM dual-row headers sharing the 0.050-inch (1.27 mm) pitch. A matching 82-position (41 per row) header variant provides controlled board-to-board stack height, typically selectable between 4 mm and 20 mm, enabling modular stacked PCB assemblies in computing and instrumentation systems.
Is the SFM-141-L2-FM-D-A suitable for FPGA or compute module expansion interfaces?
Yes. The 82-position, 1.27 mm pitch dual-row format of the SFM-141-L2-FM-D-A suits FPGA I/O expansion cards and compute modules that require a large number of parallel signal lanes in a small board area. The high-reliability contact construction supports repeated module insertion typical in development and prototyping environments, and the surface-mount footprint integrates cleanly with high-density PCB designs.
What reflow soldering requirements apply when assembling the SFM-141-L2-FM-D-A onto a PCB?
The SFM-141-L2-FM-D-A uses surface-mount terminations requiring a fine-pitch land pattern at 1.27 mm centers per SAMTEC's recommended footprint. Lead-free reflow profiles should keep peak temperature at or below 260°C with a time above liquidus of no more than 30 seconds to prevent thermal damage to the 82-position contact array and housing, consistent with IPC/JEDEC J-STD-020 MSL guidelines.
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