SFM-141-02-SM-D SAMTEC Connector (Other) In Stock
SAMTEC SFM-141-02-SM-D is an 82-position dual-row high-reliability surface-mount socket strip on 0.050 inch (1.27 mm) pitch designed for mating with standard 1.27 mm pitch pin headers. It provides precision-fit SMT connectivity for high pin-count board-to-board and mezzanine card interfaces. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 82
- Lifecycle
- ACTIVE
- Datasheet
- SFM-141-02-SM-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 82-position dual-row SMT socket strip on 0.050 inch (1.27 mm) pitch for high pin-count board-to-board mezzanine and daughter card connections
- High-reliability SFM series construction rated for higher insertion cycle counts than cost-reduced TFC alternatives, maintaining consistent contact force across repeated mate/unmate operations
- Surface-mount (SM) termination enables automated reflow placement on standard SMT lines, compatible with lead-free reflow profiles up to 260°C
- Dual-row layout arranges 82 contacts in 2 rows of 41, maximizing signal density per PCB length along card-edge interconnects
Applications
The SFM-141-02-SM-D is used in FPGA mezzanine cards, single-board computer expansion connectors, and high-channel-count data acquisition modules where 82 signal positions must be routed through a single surface-mount socket on a 1.27 mm pitch. Its high-reliability contact design supports industrial automation controllers and communication backplanes requiring low contact resistance across 50 or more insertion cycles. The SMT termination allows integration into fully automated reflow assembly lines, reducing manufacturing cost on production volumes above 500 units.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What distinguishes the SFM-141-02-SM-D from cost-reduced TFC series socket strips of similar pitch and position count?
The SFM series is SAMTEC's high-reliability socket strip line rated for a higher insertion cycle count than the cost-reduced TFC variants. SFM contacts maintain consistent normal force and low contact resistance across 50 or more mating cycles, while TFC connectors are optimized for fewer than 30 cycles. For industrial equipment requiring frequent board swap during field maintenance, the SFM-141-02-SM-D provides more durable interconnection at a moderately higher unit price per 82-position assembly.
How does the 82-position 1.27 mm pitch layout of the SFM-141-02-SM-D support FPGA or multi-bus system designs?
The 82-position dual-row layout (2 rows of 41 contacts at 1.27 mm pitch) can carry a 64-bit data bus plus 18 control, power, and ground signals through a single connector body less than 55 mm long. This single-connector approach replaces multiple narrow connectors, reducing total PCB area and minimizing signal skew between bus lines that would occur across separate connector bodies spaced farther apart.
Is the SFM-141-02-SM-D compatible with standard SMT reflow assembly and automated pick-and-place equipment?
Yes, the -SM suffix designates surface-mount termination, making the SFM-141-02-SM-D fully compatible with automated pick-and-place machines and standard lead-free reflow soldering at up to 260°C peak temperature. The component lands follow SAMTEC's standard 1.27 mm pitch pad grid, which is easily generated from the IPC-7351 footprint library or SAMTEC's free PCB library resources.
What mating connector series is the SFM-141-02-SM-D designed to accept, and what is the mating height?
The SFM-141-02-SM-D is designed to mate with SAMTEC's standard 1.27 mm pitch pin header series such as the TSW, MTMM, or TFC pin strips. The mated stack height depends on the specific pin header selected but typically ranges from 4.5 mm to 8.5 mm for standard TSW mating headers. This height range accommodates PCB-to-PCB spacing requirements in compact embedded and industrial enclosure designs.
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