SFM-141-02-L-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-141-02-L-D-A-K is an 82-position dual-row surface-mount socket strip with 0.050" (1.27 mm) pitch. Designed for high-reliability board-to-board signal connections, it supports low-profile SMT assembly. Available with multiple plating options for robust electrical performance.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 82
- Lifecycle
- ACTIVE
- Datasheet
- SFM-141-02-L-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 82-position dual-row layout at 0.050" (1.27 mm) pitch for high-density signal routing
- Surface-mount technology (SMT) termination enables automated PCB assembly compatibility
- High-reliability socket strip construction with gold-plated contacts for long-cycle durability
Applications
The SFM-141-02-L-D-A-K is well suited for high-density board-to-board interconnect applications in telecom, networking, and industrial control systems. Its 0.050" pitch dual-row layout enables compact PCB designs where space is at a premium. Engineers use this socket strip in test and measurement equipment and embedded computing modules requiring reliable signal integrity across 82 positions.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch and row configuration of the SFM-141-02-L-D-A-K connector?
The SFM-141-02-L-D-A-K features a 0.050" (1.27 mm) pitch dual-row layout with 82 total positions, making it one of SAMTEC's high-density SMT socket strips suitable for compact board-to-board interconnect designs requiring many signal lines in a minimal footprint.
Which PCB assembly processes are compatible with the SFM-141-02-L-D-A-K?
This connector uses surface-mount technology (SMT) termination, so it is compatible with standard reflow soldering processes. Its 1.27 mm pitch and low-profile body allow placement by automated pick-and-place equipment, supporting high-volume PCB production with typical solder reflow temperatures of 260°C peak.
In what kinds of high-reliability systems is the SFM-141-02-L-D-A-K typically deployed?
The SFM-141-02-L-D-A-K is commonly deployed in telecom line cards, networking backplane assemblies, industrial control modules, and test and measurement systems. Its 82-position dual-row configuration at 0.050" pitch provides sufficient signal density for FPGA, DSP, and processor-to-memory board interconnects demanding reliable performance over thousands of mating cycles.
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