SFM-141-02-H-D-A SAMTEC Connector (Other) In Stock
SAMTEC SFM-141-02-H-D-A is an 82-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch and a horizontal surface mount configuration. Engineered for high-density board-to-board interconnect with gold-plated contacts rated for extended mating cycles. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 82
- Lifecycle
- ACTIVE
- Datasheet
- SFM-141-02-H-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 82-position dual-row horizontal SMT configuration at 0.050" (1.27 mm) pitch for space-efficient high-density layouts
- Gold-plated contacts providing low insertion force and reliable electrical performance over hundreds of mating cycles
- High-reliability SFM series construction supporting thermal environments from -55°C to +125°C
Applications
The SFM-141-02-H-D-A serves high-density mezzanine and stacked board applications in data communications, test and measurement equipment, and defense electronics requiring 82 signal positions at 0.050" pitch. Its horizontal SMT termination style is optimized for board edge or right-angle stacking configurations where vertical clearance is restricted. This connector is also deployed in compact instrumentation modules and FPGA-based signal processing cards.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the horizontal (H) termination of the SFM-141-02-H-D-A affect PCB footprint and routing?
The H suffix denotes a horizontal SMT termination where solder tails exit parallel to the PCB surface, making the SFM-141-02-H-D-A ideal for right-angle or edge stacking configurations. This orientation allows two boards to be connected at a 90-degree angle with 82 signal paths at 0.050" pitch, enabling rack-style modular assemblies where one board stands perpendicular to a backplane.
What signal density advantage does the 0.050" pitch on the SFM-141-02-H-D-A offer over 0.100" connectors?
At 0.050" (1.27 mm) pitch, the SFM-141-02-H-D-A routes 82 positions in approximately half the linear length of an equivalent 0.100" pitch connector, reducing the connector footprint by up to 50% per row. This density advantage is critical in high-layer-count PCBs above 10 layers where routing escape from connector pads is space-constrained.
Which design scenarios make the SFM-141-02-H-D-A preferable to a vertical SMT socket strip?
Horizontal termination is preferred when the mating board must be oriented perpendicular to the carrier board, such as in edge-card daughtercard slots or right-angle backplane assemblies. For the 82-position SFM-141-02-H-D-A, this means the 0.050" pitch interface connects a vertical daughtercard to a horizontal motherboard, saving up to 15 mm of vertical stack height compared to using vertical SFM connectors with an intermediate flex adapter.
Is the SFM-141-02-H-D-A compatible with standard lead-free reflow soldering processes?
Yes, the SFM-141-02-H-D-A is compatible with lead-free reflow soldering at peak temperatures up to 260°C, conforming to IPC/JEDEC J-STD-020 moisture sensitivity requirements. The connector housing material retains its structural integrity through multiple reflow passes, and the gold-plated contacts maintain low contact resistance below 20 milliohms after thermal cycling from -55°C to +125°C.
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