SFM-140-L2-F-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-140-L2-F-D-A-K is an 80-position dual-row surface mount socket strip with 0.050" (1.27 mm) pitch, offering high reliability for dense board-to-board connections. Features gold-plated contacts for superior conductivity. Available for worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 80
- Lifecycle
- ACTIVE
- Datasheet
- SFM-140-L2-F-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 80-position dual-row configuration on 0.050" (1.27 mm) pitch for high-density signal routing
- Surface mount termination enables automated PCB assembly with reflow soldering compatibility
- Gold-plated contacts deliver low contact resistance and long-term corrosion resistance across thousands of mating cycles
Applications
The SFM-140-L2-F-D-A-K is well-suited for high-density board-to-board interconnects in telecommunications, computing, and test and measurement systems. Its 80-position dual-row layout supports parallel signal buses requiring compact footprints on surface mount PCBs. It is commonly used in data acquisition modules, backplane systems, and modular embedded computing platforms.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch and row configuration of the SFM-140-L2-F-D-A-K?
The SFM-140-L2-F-D-A-K features a dual-row configuration with 80 positions total on a 0.050" (1.27 mm) pitch. This compact spacing allows high-density signal routing in space-constrained PCB designs, making it suitable for applications requiring 40 pins per row in a surface mount footprint.
Which PCB assembly processes are compatible with the SFM-140-L2-F-D-A-K socket strip?
The SFM-140-L2-F-D-A-K uses surface mount technology (SMT) termination, making it fully compatible with automated reflow soldering assembly processes. Its 1.27 mm pitch footprint aligns with standard SMT pick-and-place equipment, supporting high-volume production lines while maintaining reliable solder joint integrity across the 80 positions.
How does the SFM-140-L2-F-D-A-K compare to through-hole alternatives for backplane interconnects?
Unlike through-hole connectors that require wave soldering or hand assembly, the SFM-140-L2-F-D-A-K's surface mount design reduces PCB layer requirements by eliminating plated through-holes, saving board space. The 0.050" pitch and 80-position dual-row arrangement deliver comparable signal density while enabling double-sided component placement on boards as thin as 1.6 mm.
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