SFM-139-T2-LM-D-A SAMTEC Connector (Other) In Stock
SFM-139-T2-LM-D-A is a dual-row, 78-position high-reliability socket strip from SAMTEC with 0.050-inch pitch for surface-mount assembly. It delivers robust mating cycles and precision contact retention for dense board-to-board interconnects. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- SFM-139-T2-LM-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Dual-row 78-position surface-mount socket with 0.050-inch (1.27 mm) pitch enabling high-density board-to-board interconnection
- High-reliability contact design rated for repeated mating cycles, ensuring long service life in demanding applications
- Surface-mount termination style compatible with standard SMT reflow soldering processes for streamlined PCB assembly
- Low-profile socket strip form factor supporting compact module stacking and daughter-card attachment in tight enclosures
Applications
The SFM-139-T2-LM-D-A is used in high-density daughter-card and mezzanine board assemblies where 78 signal connections must be routed across a 0.050-inch pitch footprint. Its surface-mount design suits automated SMT production lines in telecommunications, industrial computing, and test-and-measurement equipment. The connector also fits FPGA evaluation boards and embedded processor modules requiring reliable multi-signal interfaces.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the SFM-139-T2-LM-D-A provide, and what is its row configuration?
The SFM-139-T2-LM-D-A features 78 positions arranged in a dual-row configuration with a 0.050-inch (1.27 mm) pitch. This layout supports 39 pins per row, enabling high-density signal routing in compact board-to-board interconnect designs with minimal PCB real estate.
Which PCB assembly process is compatible with the SFM-139-T2-LM-D-A, and does it support reflow soldering?
The SFM-139-T2-LM-D-A uses a surface-mount termination style fully compatible with standard SMT reflow soldering at up to 260°C peak temperature. This allows automated pick-and-place assembly and eliminates through-hole drilling requirements, reducing manufacturing cost and improving board density.
In what applications is the SFM-139-T2-LM-D-A commonly used as a mezzanine connector?
This 78-position socket strip is widely deployed in FPGA evaluation boards, embedded computing modules, and test-and-measurement daughter cards where multiple high-speed signals must bridge two PCBs across a 0.050-inch pitch interface, supporting data rates up to several Gbps per lane depending on PCB stackup.
How does the 0.050-inch pitch of the SFM-139-T2-LM-D-A compare to standard 0.100-inch pitch connectors for space-constrained designs?
At 0.050 inches (1.27 mm), the SFM-139-T2-LM-D-A occupies roughly half the board footprint of a 0.100-inch pitch connector with equivalent pin count, reducing required PCB area by approximately 50%. This makes it preferable for compact industrial controllers and portable instrumentation where connector real estate directly limits enclosure size.
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