SFM-139-T2-H-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-139-T2-H-D-A-P is a 78-position dual-row high-reliability SMD socket strip at 0.050-inch pitch with tall (H) standoff height and surface-mount termination, suited for high-density module interconnects. Stocked globally with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- SFM-139-T2-H-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 78-position dual-row SMD socket at 0.050-inch (1.27 mm) pitch providing very high signal density for large-scale module-to-board interconnects
- Tall (H) standoff height creates vertical clearance between mated boards, accommodating components on the plug-in module face that exceed standard-height socket clearance
- High-reliability contact design maintains consistent engagement force across all 78 positions through many insertion cycles in development and production test environments
Applications
The SFM-139-T2-H-D-A-P is designed for large daughtercard and mezzanine module connections in server blades, FPGA compute modules, and advanced data acquisition systems needing 78 high-reliability socket contacts at 0.050-inch pitch. Its tall standoff height accommodates components mounted on the underside of plug-in modules, making it ideal for modular radio frequency (RF) front-end boards, GPU expansion modules, and high-channel-count sensor arrays. Surface-mount termination enables direct reflow soldering for streamlined PCB assembly without through-hole processing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the signal capacity of SFM-139-T2-H-D-A-P, and how does its 78-pin count serve large module designs?
The SFM-139-T2-H-D-A-P provides 78 contact positions arranged in dual rows at 0.050-inch (1.27 mm) pitch, with 39 contacts per row. This high pin count in a compact 0.050-inch pitch footprint supports large signal buses, multi-lane high-speed interfaces, and complex power-and-signal combinations common in FPGA compute modules and server blade daughtercards.
Why does the H (tall height) standoff on SFM-139-T2-H-D-A-P matter for mezzanine and RF module assemblies?
The H standoff designation on SFM-139-T2-H-D-A-P indicates an increased vertical separation between the motherboard and the mated daughtercard, providing clearance for components mounted on the module's bottom face such as decoupling capacitors, shielding cans, or RF components that extend several millimeters below the module substrate. Without this tall standoff, those components would physically contact the motherboard surface across the 78-pin connection area.
How does using a single SFM-139-T2-H-D-A-P compare to splitting the interface across multiple smaller 0.050-inch socket strips?
A single SFM-139-T2-H-D-A-P with 78 positions provides a mechanically unified, self-locating interface that maintains consistent contact alignment across all 78 signals, whereas splitting into two or more smaller strips introduces alignment tolerance stack-up and separate soldering steps. For high-speed differential pairs and impedance-controlled signals within a 78-pin bus, the unified socket ensures consistent stub length and ground return path geometry that multiple separate connectors cannot guarantee.
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