SFM-139-L2-STL-D-A-K SAMTEC Connector (Other) In Stock
The SFM-139-L2-STL-D-A-K is a 78-position, dual-row, high-reliability socket strip from SAMTEC with a 0.050-inch (1.27 mm) pitch for surface mount PCB assembly. It features gold-plated contacts and a dual-row configuration providing 78 signal connections in a compact high-density footprint. Available with worldwide distribution for fast delivery in telecommunications, computing, and embedded systems applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- SFM-139-L2-STL-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 78-position dual-row layout at 0.050-inch (1.27 mm) pitch delivering high-density interconnect in half the board space of standard 0.100-inch pitch connectors
- High-reliability surface mount design with gold-plated contacts ensuring stable low-resistance connections through extended mating cycles
- Stacking and board-to-board configuration enabling modular mezzanine card assembly in space-constrained embedded and FPGA platforms
Applications
The SFM-139-L2-STL-D-A-K is ideal for mezzanine card-to-carrier board interconnects in FPGA development platforms, embedded computing modules, and high-density test and measurement equipment. Its 0.050-inch pitch dual-row 78-position design supports reliable signal and power routing in telecommunications line cards, military electronics, and industrial control systems where board area is tightly constrained.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the SFM-139-L2-STL-D-A-K provide and how does this compare to a 0.100-inch pitch alternative?
The SFM-139-L2-STL-D-A-K offers 78 positions at a 0.050-inch (1.27 mm) pitch in a dual-row surface mount package. Compared to a standard 0.100-inch (2.54 mm) pitch connector with the same 78 positions, this 1.27 mm pitch design occupies roughly half the PCB footprint length, enabling significantly higher connector density in space-constrained embedded computing and FPGA mezzanine board designs.
For which mezzanine board applications is the SFM-139-L2-STL-D-A-K a reliable interconnect choice?
The SFM-139-L2-STL-D-A-K is a reliable choice for FPGA mezzanine card interfaces, FMC (FPGA Mezzanine Card) board-to-carrier connections, and high-density embedded computing platforms that require 78 signal connections at 0.050-inch pitch. Its high-reliability surface mount gold-plated contacts support thousands of mating cycles, making it suitable for test fixtures and field-replaceable module systems as well.
How does the dual-row configuration of the SFM-139-L2-STL-D-A-K benefit high-speed signal routing compared to a single-row socket?
The dual-row configuration of the SFM-139-L2-STL-D-A-K places 78 positions across 2 rows at 0.050-inch (1.27 mm) pitch, which shortens the connector's overall length by approximately 50% compared to a single-row 78-position alternative at the same pitch. This shorter stub length reduces signal propagation skew between channels, benefiting high-speed differential signal pairs at multi-gigabit data rates in SERDES and PCIe interface applications.
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