SFM-139-L2-H-D-A SAMTEC Connector (Other) In Stock
SFM-139-L2-H-D-A is a SAMTEC 78-position dual-row high-reliability socket strip with 1.27 mm (0.050") pitch in a surface-mount package. It provides 78 contacts for high-density board-to-board or mezzanine connections with reliable contact engagement. Available from stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- SFM-139-L2-H-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 78-position dual-row layout at 1.27 mm (0.050") pitch providing 78 contacts in a compact SMT high-density footprint
- High-reliability socket strip construction for repeated mating cycles in test, development, and field-serviceable equipment
- Surface-mount termination enabling automated SMT assembly on both prototype and production PCBs
- SAMTEC SFM series compatibility with standard 0.050" pitch headers for mezzanine board stacking and module interconnects
Applications
The SFM-139-L2-H-D-A is used in high-density mezzanine board stacking, FPGA daughter card interfaces, and module-to-baseboard interconnects where 1.27 mm pitch maximizes I/O count in limited board area. Its 78-contact dual-row configuration supports simultaneous signal and power distribution across processor modules, memory expansion boards, and RF front-end assemblies. The high-reliability socket design also suits test fixtures and development evaluation platforms that require repeated insertion and removal cycles without degrading contact integrity.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact pitch and total pin count does the SFM-139-L2-H-D-A provide for high-density interconnects?
The SFM-139-L2-H-D-A has a 1.27 mm (0.050") pitch with 78 positions in a dual-row layout, delivering 78 total contacts per connector. This pitch allows twice the contact density of standard 2.54 mm connectors in the same board length, making it suitable for high-density FPGA I/O headers, processor module interfaces, and compact mezzanine board stacking applications.
How many mating cycles can the SFM-139-L2-H-D-A socket strip withstand in test fixture applications?
SAMTEC SFM high-reliability socket strips are designed for multiple mating cycles, with typical ratings of 30 or more insertions while maintaining contact force and electrical continuity. The 78-position, 1.27 mm pitch design is well suited for development boards, JTAG test headers, and module evaluation fixtures where connectors are mated and unmated frequently during bring-up and validation.
What mating header is compatible with the SFM-139-L2-H-D-A socket strip?
The SFM-139-L2-H-D-A mates with SAMTEC TSM or equivalent 1.27 mm (0.050") pitch dual-row headers. Any 78-position, 2-row header conforming to the 0.050" pitch grid is compatible, giving designers flexibility to use SAMTEC TFM, HFM, or third-party 1.27 mm pitch male headers on the opposing board in mezzanine and module stacking configurations.
Is the SFM-139-L2-H-D-A compatible with standard SMT reflow assembly, and how should it be handled during soldering?
Yes, the SFM-139-L2-H-D-A is a surface-mount component rated for standard SMT reflow solder profiles. The socket body should be placed using automated pick-and-place equipment, and peak reflow temperatures must not exceed the plastic housing material limit, typically 260°C for 10 seconds, following SAMTEC's published reflow guidelines. The 78-contact, 1.27 mm pitch footprint should be verified against the PCB land pattern before production.
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