SFM-139-L2-F-D-LC SAMTEC Connector (Other) In Stock
The SAMTEC SFM-139-L2-F-D-LC is a 78-position dual-row high-reliability surface mount socket strip with 0.050 inch (1.27 mm) pitch for fine-pitch board-to-board mating applications. It features a female dual-row layout in a low-profile surface mount configuration suited for high-signal-count daughter card and mezzanine board interfaces. Stocked at authorized global distributors, this connector delivers dependable fine-pitch performance for FPGA platforms, communications hardware, and compact embedded system interconnects.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- SFM-139-L2-F-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-139-L2-F-D-LC?
- 78-position dual-row layout on 0.050 inch (1.27 mm) pitch delivers maximum contact density for high-signal-count interconnects
- High-reliability female socket design maintains consistent contact retention across repeated mating cycles in demanding environments
- Low-profile surface mount configuration minimizes PCB height clearance requirements in compact electronic assemblies
- Female dual-row construction mates with SAMTEC-compatible fine-pitch headers for secure mechanical and electrical engagement
What is SFM-139-L2-F-D-LC used for?
The SFM-139-L2-F-D-LC is designed for high-density board-to-board and mezzanine card interconnect applications in data communications, FPGA evaluation platforms, and high-performance computing hardware. Its 78-position dual-row configuration on a 0.050 inch pitch provides 78 signal or power connections within a minimal board footprint, making it suitable for daughter card interfaces, memory modules, and modular embedded system backplanes. Engineers select this connector when high signal density, surface mount assembly, and reliable fine-pitch mating performance are essential in a single package.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-139-L2-F-D-LC datasheet?
SFM-139-L2-F-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-139-L2-F-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many contacts does the SFM-139-L2-F-D-LC provide, and at what pitch are they arranged?
The SFM-139-L2-F-D-LC provides 78 pins arranged as 39 contacts per row in a dual-row 0.050 inch (1.27 mm) pitch format. This fine pitch allows twice the contact density of a standard 0.100 inch connector in the same board length, making it ideal for high-signal-count board-to-board interfaces in compact embedded and communications designs.
For which high-density PCB interconnect scenarios is the SFM-139-L2-F-D-LC most commonly specified?
The SFM-139-L2-F-D-LC is well-suited for FPGA mezzanine cards, network line cards, high-performance computing daughter boards, and modular test fixtures requiring 78 pins of reliable dual-row connectivity at 0.050 inch pitch. Its surface mount profile simplifies automated SMT assembly and eliminates through-hole drilling on fine-pitch board layouts.
How does the dual-row layout of SFM-139-L2-F-D-LC reduce connector length versus single-row alternatives?
By placing 39 contacts in each of two rows on a 0.050 inch pitch, the SFM-139-L2-F-D-LC achieves 78 pins total in roughly half the board-edge length a single-row connector would need at the same pitch. This configuration frees space adjacent to the connector footprint for signal routing, bypass capacitors, and filter components in high-density PCB layouts.
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About SAMTEC
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