SFM-139-02-L-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-139-02-L-D-A-K is a 78-position dual-row 0.050" pitch surface-mount high-reliability socket strip with low-profile (L) design and kinematic locking retention, with gold-plated contacts rated for 1 A per pin. Optimized for slim mezzanine board-to-board interconnects requiring maximum channel density and secure mating.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- SFM-139-02-L-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 78-position dual-row configuration at 0.050" (1.27 mm) pitch delivers one of the highest channel densities available in the SFM surface-mount socket family
- Low-profile (L) standoff minimizes mated stack height for use in slim enclosures and space-constrained PCB stacks
- Kinematic (K) locking system prevents unmating under vibration, maintaining reliable 1 A-rated contact performance across 200+ mating cycles
Applications
The SFM-139-02-L-D-A-K is designed for very-high-channel-count mezzanine interconnect applications in advanced FPGA carrier boards, high-density data acquisition systems, and ruggedized industrial computing modules where 78 signal channels must be routed at 0.050" pitch in a slim PCB stack. Its low-profile design and kinematic retention make it suitable for compact electronic assemblies operating in environments with vibration or space constraints.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the maximum channel count and per-pin current rating of the SFM-139-02-L-D-A-K?
The SFM-139-02-L-D-A-K provides 78 signal positions in a dual-row arrangement at 0.050" (1.27 mm) pitch, with 39 gold-plated contacts per row each rated for 1 A continuous current. This makes it one of the highest channel-density options in the SAMTEC SFM series for surface-mount mezzanine board-to-board interconnect designs.
For a slim tablet or embedded computing enclosure, how does the low-profile (L) option of SFM-139-02-L-D-A-K reduce board stack height?
The low-profile (L) standoff option reduces the mated connector stack height compared to standard or high-profile SFM variants, achieving a thinner board separation that is critical when total enclosure thickness is constrained to less than 10 mm. This design is particularly beneficial in portable computing, medical wearables, and embedded systems where 78 signal channels must pass between stacked boards within a minimal z-height.
When selecting between SFM-139-02-L-D-A-K and a 78-position through-hole alternative, what manufacturing considerations favor the SMT version?
The surface-mount termination of the SFM-139-02-L-D-A-K eliminates the need for 78 through-hole drills per connector, reducing PCB layer occupation and allowing finer routing on inner layers directly beneath the connector footprint. Standard SMT reflow up to 260°C processes both the connector and surrounding components simultaneously, versus wave or selective soldering required for through-hole 78-pin alternatives, lowering assembly cost in high-volume production.
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