SFM-139-02-F-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-139-02-F-D-A-P is a 78-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch for surface mount PCB assembly. Designed for fine-pitch mezzanine board stacking with 78 contacts providing dense signal routing across daughter card interfaces. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- SFM-139-02-F-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 78-position dual-row 0.050" (1.27 mm) pitch SMT socket strip for ultra-high-density fine-pitch mezzanine interconnects
- High-reliability socket contact design with dual-wipe geometry maintaining low contact resistance after repeated insertion cycles
- Surface mount assembly compatible with standard reflow soldering, eliminating through-hole drilling for 78-contact board stacking
Applications
The SFM-139-02-F-D-A-P is suited for high-channel-count mezzanine interfaces in embedded computing platforms, FPGA carrier boards, and communication daughter cards where 78 signal lines must be routed between stacked PCBs in a compact form factor. Its 0.050" fine pitch allows twice the contact density of a 0.100" equivalent, enabling high-speed differential pairs, power rails, and control signals to share a single connector site. The surface mount footprint integrates into standard SMT assembly processes using reflow soldering without any additional through-hole steps.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many differential signal pairs can the SFM-139-02-F-D-A-P support across its 78 positions on a high-speed mezzanine interface?
The SFM-139-02-F-D-A-P dual-row 78-position layout can accommodate up to 39 differential signal pairs when contacts in each row are paired as positive and negative partners, supporting high-speed LVDS, HSTL, or LVCMOS signaling at data rates above 1 Gbps per pair. The remaining positions can be assigned to power rails and grounds, providing a complete 78-contact signal and power interface in a single 0.050" pitch connector.
For a PCB design engineer migrating from 0.100" pitch connectors to the SFM-139-02-F-D-A-P, what footprint area change should be expected?
Switching from a 0.100" (2.54 mm) pitch 78-position connector to the SFM-139-02-F-D-A-P at 0.050" (1.27 mm) pitch reduces the connector body length by approximately 50%, since the halved pitch compresses 78 contacts into roughly the same board length as a 39-position 0.100" connector. This translates to freeing approximately 40 mm to 50 mm of PCB edge length, a significant board area saving for high-density embedded modules.
In a test fixture application requiring frequent daughter card swaps, how durable is the SFM-139-02-F-D-A-P socket strip over multiple insertion cycles?
The SFM-139-02-F-D-A-P uses a high-reliability socket contact construction with spring-loaded wiping contacts designed to maintain consistent electrical connection after repeated mating operations, typically rated for 50 or more insertion-extraction cycles with contact resistance remaining below 30 milliohms. For test fixtures where daughter cards are swapped daily during development or production testing, this reliability level ensures the 78-position socket retains repeatable electrical contact without significant wear-related resistance increase.
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