SFM-138-T2-STL-D-A SAMTEC Connector (Other) In Stock
SAMTEC SFM-138-T2-STL-D-A is a 76-position dual-row surface mount socket strip with 0.050" (1.27 mm) pitch. Features high-reliability construction with gold-plated contacts. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- SFM-138-T2-STL-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 76-position dual-row configuration on 0.050" (1.27 mm) pitch for high-density PCB layouts
- Surface mount technology (SMT) for automated assembly and reflow soldering compatibility
- High-reliability design with gold-plated contacts for low-contact-resistance signal integrity
Applications
The SFM-138-T2-STL-D-A is suited for high-density board-to-board and board-to-module interconnect designs where a 1.27 mm pitch surface-mount interface is required. It is commonly used in embedded computing platforms, test-and-measurement instruments, and FPGA-based carrier boards needing reliable 76-pin dual-row connectivity. Its compact SMT footprint supports miniaturized industrial electronics and communication modules.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and row configuration does the SFM-138-T2-STL-D-A use?
The SFM-138-T2-STL-D-A features a dual-row layout on a 0.050" (1.27 mm) pitch, providing 76 total positions. This compact pitch allows high-density signal routing on surface-mount PCBs while maintaining reliable electrical contact across all 76 pins.
Which PCB assembly process is compatible with the SFM-138-T2-STL-D-A?
The connector uses surface mount technology, making it fully compatible with standard reflow soldering processes at typical peak temperatures around 260°C. Its SMT footprint allows pick-and-place automated assembly, reducing hand-soldering labor in volume production runs.
When would the SFM-138-T2-STL-D-A be preferred over a through-hole socket strip?
The SFM-138-T2-STL-D-A is preferred when board thickness or component density constraints rule out through-hole drilling, especially in multilayer designs with 4 or more PCB layers. Its 1.27 mm pitch saves significant board area compared to 2.54 mm pitch through-hole alternatives, enabling denser system integration with 76 signals in a compact SMT footprint.
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