SFM-138-T2-H-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-138-T2-H-D-A-P is a 76-position dual-row high-reliability SMT socket strip with 0.050-inch (1.27 mm) pitch and high-profile mated height, designed for dense board-to-board interconnect in mezzanine and stacked module applications. Tiger Beam contacts deliver superior normal force for reliable multi-cycle mating. Available for worldwide distribution in standard packaging.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- SFM-138-T2-H-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 76-position dual-row SMT socket at 0.050 inch (1.27 mm) pitch providing 38 contacts per row for very high-density board-to-board signal and power routing
- Tiger Beam (-T2) dual-beam contact technology delivering enhanced normal force retention and self-wiping action for superior electrical reliability across mating cycles
- High-profile (-H) mated height creating board-to-board clearance of 8 mm or more to accommodate tall on-board components on mezzanine PCBs
- High-reliability socket design engineered for demanding embedded computing, communications, and defense electronics applications requiring sustained contact resistance below 30 milliohms
Applications
The SFM-138-T2-H-D-A-P is used in high-density FPGA daughter cards, communications backplane modules, and defense avionics boards where 76 signal and power connections must be reliably sustained between two stacked PCBs. Its Tiger Beam dual-beam contacts maintain reliable electrical continuity through vibration, thermal cycling from -55°C to 125°C, and repeated module insertion, making it well-suited for MIL-COTS and ruggedized embedded computing applications. The high-profile mated height accommodates tall power supply components, heat sinks, and RF shields on the mezzanine card.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What distinguishes Tiger Beam (-T2) contacts in the SFM-138-T2-H-D-A-P from standard single-beam contacts in performance-critical applications?
Tiger Beam (-T2) contacts use a dual-beam design where two independent contact springs engage the mating pin simultaneously, providing double the normal force and a self-wiping action that clears surface oxidation with each mating cycle. Standard single-beam contacts have a single point of contact per pin, whereas the T2 configuration maintains electrical continuity even if one beam encounters a surface defect or contaminant. This makes Tiger Beam contacts preferable in applications with contact resistance budgets below 20 milliohms or in environments where mild corrosion, vibration, or thermal cycling could compromise a single-beam interconnect.
For a 76-channel FPGA daughter card design, how does the SFM-138 at 0.050 inch pitch help manage routing congestion on the baseboard?
At 0.050 inch (1.27 mm) pitch, the SFM-138-T2-H-D-A-P concentrates 76 signal paths into a dual-row footprint approximately 49 mm long. The same 76-position count at 0.100 inch pitch would require a connector approximately 97 mm long, consuming nearly double the PCB edge space and forcing signal escape routes through more PCB layers. For FPGA daughter cards with dense BGA escape routing, the shorter 0.050 inch connector reduces via field length by up to 50 mm, shortening trace stubs and improving signal integrity at data rates above 500 Mbps.
What thermal operating range should engineers assume for the SFM-138-T2-H-D-A-P in a ruggedized embedded module?
SAMTEC SFM-series high-reliability socket strips are designed for operation across a wide temperature range of -55°C to 125°C, covering commercial, industrial, and COTS military temperature grades. This range means the SFM-138-T2-H-D-A-P maintains contact resistance below 30 milliohms and mechanical integrity through thermal cycling between cold storage at -55°C and operating junction temperatures up to 125°C. For ruggedized avionics and defense embedded computing modules that must meet MIL-STD-810 thermal shock profiles, this range provides adequate design margin.
How does the SFM-138-T2-H-D-A-P differ from the SFM-138-T2-H-D-A-P-TR variant and which should a production engineer specify?
The SFM-138-T2-H-D-A-P ships in tray or tube packaging suitable for manual placement or low-volume automated assembly, while the -TR suffix variant ships in tape-and-reel format with standard reel quantities of 500 to 1,000 pieces for high-volume SMT pick-and-place machines. Production engineers running volumes above 500 units per batch should specify the -TR reel variant to minimize manual feeder setup and reduce per-unit placement cost by typically 10 to 20 seconds per connector. For prototyping or NPI runs under 50 units, the standard tray-packaged SFM-138-T2-H-D-A-P avoids the minimum reel-quantity commitment.
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