SFM-138-L2-STL-D SAMTEC Connector (Other) In Stock
SAMTEC SFM-138-L2-STL-D is a 76-position, dual-row, high-reliability socket strip with 0.050" (1.27 mm) pitch for surface mount board-to-board applications. Features low insertion force design for repeated use in high-density FPGA, memory, and computing module interconnects.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- SFM-138-L2-STL-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 76-position dual-row SMT socket strip at 0.050" (1.27 mm) pitch with low insertion force (L2) design enabling easy mating and unmating of high pin count FPGA and memory module daughtercards
- High-reliability contact system designed for multiple mating cycles, maintaining consistent contact resistance and mechanical retention across computing, industrial, and instrumentation daughtercard applications
- STL (surface mount tails) termination style allows reflow soldering compatibility, simplifying integration into standard SMT PCB assembly processes for compact high-density board stacking
Applications
The SFM-138-L2-STL-D is used in high-density FPGA mezzanine boards, embedded computing modules, and memory expansion cards that require 76-position, 0.050" pitch SMT sockets with low insertion force for frequent daughtercard swapping. Its dual-row layout and high-reliability contact system make it suitable for industrial automation controllers, communications line cards, and military-grade computing backplanes. Test and measurement systems also employ this socket strip for its repeatable low insertion force mating with high pin count probe adapters and signal conditioning modules.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the L2 designation mean for the SFM-138-L2-STL-D and how does it benefit field-replaceable module designs?
The L2 designation in SFM-138-L2-STL-D indicates a low insertion force (LIF) contact design, which reduces the force required to mate and unmate the 76-position, 0.050" dual-row socket from its mating header. This is critical for field-replaceable FPGA daughtercards and computing modules that are swapped frequently, reducing the risk of PCB pad damage or connector body stress during repeated insertion and removal cycles.
How does the 76-position count of the SFM-138-L2-STL-D address FPGA and memory module interface requirements?
With 76 positions at 0.050" (1.27 mm) pitch in a dual-row SMT layout, the SFM-138-L2-STL-D can carry 38 differential pairs or 76 single-ended signals simultaneously. This capacity is well-matched to FPGA I/O expansion, DDR memory interface, or multi-channel ADC data buses on high-performance embedded computing, signal processing, and communications boards where wide parallel interfaces are required in a compact SMT footprint.
Which SAMTEC mating headers are compatible with the SFM-138-L2-STL-D for board-to-board stacking applications?
The SFM-138-L2-STL-D mates with SAMTEC TSM and SFM series pin headers at 0.050" (1.27 mm) pitch in a 76-position dual-row configuration. These mating headers are available in multiple stack heights from approximately 0.10" to 0.50", allowing engineers to select the appropriate board separation for their FPGA mezzanine, memory module, or industrial backplane design while maintaining the same SMT socket footprint.
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