SFM-138-L2-SM-D-A-P SAMTEC Connector (Other) In Stock

SAMTEC SFM-138-L2-SM-D-A-P is a 76-position dual-row high-reliability socket strip at 0.050" pitch for surface-mount PCB assembly. Designed for dense board-to-board mating in high-cycle applications requiring consistent electrical performance. Available from stock with worldwide shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
SFM-138-L2-SM-D-A-POther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
76
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 76-position dual-row layout at 0.050" (1.27 mm) pitch enables high-density signal interconnect in minimal PCB footprint for compact embedded designs
  • High-reliability socket strip construction supports repeated mating cycles without degradation, ensuring long-term performance in industrial and telecom applications
  • Surface-mount termination style simplifies automated PCB assembly and eliminates through-hole drilling, reducing PCB fabrication complexity

Applications

The SFM-138-L2-SM-D-A-P is suited for high-density board-to-board and mezzanine interconnect applications in communications equipment, industrial computing platforms, and FPGA development boards. Its 76-position dual-row socket at 0.050" pitch accommodates wide data buses and mixed signal/power rails in a space-efficient footprint. The surface-mount design integrates seamlessly into automated SMT assembly lines for volume production.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Datasheet

SFM-138-L2-SM-D-A-P Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How many signal positions does SFM-138-L2-SM-D-A-P provide, and how does its 0.050" pitch help with high-density routing?

The SFM-138-L2-SM-D-A-P provides 76 positions in a dual-row layout at 0.050" (1.27 mm) pitch, packing significantly more connections per inch than 0.100" pitch alternatives, which is critical when routing wide FPGA I/O buses or multi-channel data acquisition signals on space-constrained PCBs.

What manufacturing advantage does the surface-mount style of SFM-138-L2-SM-D-A-P offer over through-hole socket strips?

Surface-mount termination on the SFM-138-L2-SM-D-A-P eliminates the need for 76 drilled through-holes per connector, reducing PCB fabrication cost and enabling placement on high-density multilayer boards. It also allows placement on both sides of the PCB and integrates into standard SMT reflow soldering processes.

In which board-to-board or mezzanine applications is SFM-138-L2-SM-D-A-P a preferred socket solution?

SFM-138-L2-SM-D-A-P is preferred in mezzanine-style expansions for FPGA boards, single-board computers, and telecom line cards where 76 signals must cross between stacked PCBs, and where the high-reliability rating ensures signal integrity is maintained over thousands of mate and unmate cycles in the field.

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About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
Contact for Price
Buy from 1pc · Factory-direct pricing
pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

MR
Marco Rossi
CTO, AutoDrive Systems, Italy