SFM-138-L2-SM-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-138-L2-SM-D-A-P is a 76-position dual-row high-reliability socket strip at 0.050" pitch for surface-mount PCB assembly. Designed for dense board-to-board mating in high-cycle applications requiring consistent electrical performance. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- SFM-138-L2-SM-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 76-position dual-row layout at 0.050" (1.27 mm) pitch enables high-density signal interconnect in minimal PCB footprint for compact embedded designs
- High-reliability socket strip construction supports repeated mating cycles without degradation, ensuring long-term performance in industrial and telecom applications
- Surface-mount termination style simplifies automated PCB assembly and eliminates through-hole drilling, reducing PCB fabrication complexity
Applications
The SFM-138-L2-SM-D-A-P is suited for high-density board-to-board and mezzanine interconnect applications in communications equipment, industrial computing platforms, and FPGA development boards. Its 76-position dual-row socket at 0.050" pitch accommodates wide data buses and mixed signal/power rails in a space-efficient footprint. The surface-mount design integrates seamlessly into automated SMT assembly lines for volume production.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does SFM-138-L2-SM-D-A-P provide, and how does its 0.050" pitch help with high-density routing?
The SFM-138-L2-SM-D-A-P provides 76 positions in a dual-row layout at 0.050" (1.27 mm) pitch, packing significantly more connections per inch than 0.100" pitch alternatives, which is critical when routing wide FPGA I/O buses or multi-channel data acquisition signals on space-constrained PCBs.
What manufacturing advantage does the surface-mount style of SFM-138-L2-SM-D-A-P offer over through-hole socket strips?
Surface-mount termination on the SFM-138-L2-SM-D-A-P eliminates the need for 76 drilled through-holes per connector, reducing PCB fabrication cost and enabling placement on high-density multilayer boards. It also allows placement on both sides of the PCB and integrates into standard SMT reflow soldering processes.
In which board-to-board or mezzanine applications is SFM-138-L2-SM-D-A-P a preferred socket solution?
SFM-138-L2-SM-D-A-P is preferred in mezzanine-style expansions for FPGA boards, single-board computers, and telecom line cards where 76 signals must cross between stacked PCBs, and where the high-reliability rating ensures signal integrity is maintained over thousands of mate and unmate cycles in the field.
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