SFM-138-L2-S-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-138-L2-S-D-A-K is a 76-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch in a surface mount package. Provides 38 pins per row with gold-plated contacts for reliable, repeatable mating in high-density mezzanine and module interconnect applications. Available from stock worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- SFM-138-L2-S-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 76-position dual-row 0.050" (1.27 mm) pitch surface mount socket strip with 38 pins per row enabling high signal count interconnects in compact PCB designs
- High-reliability gold-plated contacts providing low contact resistance and consistent electrical performance across many insertion and removal cycles in modular board systems
- Surface mount construction compatible with automated pick-and-place assembly and lead-free reflow soldering, supporting high-volume PCB manufacturing workflows
Applications
The SFM-138-L2-S-D-A-K is used for high-density mezzanine board stacking, FPGA I/O expansion daughtercard connections, and modular subsystem interfaces in communications, computing, and test and measurement equipment. Its 76-position dual-row 0.050" pitch layout efficiently routes parallel bus signals, mixed-signal I/O, and power distribution across compact PCB assemblies in space-constrained system designs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pin count and row configuration does the SFM-138-L2-S-D-A-K offer, and what is its contact pitch?
The SFM-138-L2-S-D-A-K provides 76 total positions arranged in 2 rows with 38 pins per row at a 0.050" (1.27 mm) center-to-center pitch. This dual-row 1.27 mm pitch arrangement achieves twice the signal density of standard 2.54 mm pitch connectors in the same PCB footprint length, making it well suited for FPGA expansion boards and high-channel-count module interfaces in space-constrained enclosures.
Which mating header connector family is compatible with the SFM-138-L2-S-D-A-K socket strip?
The SFM-138-L2-S-D-A-K is designed to mate with SAMTEC's TSM or SHF series 0.050" pitch dual-row 76-position header connectors. The gold-plated contact system delivers typical contact resistance below 20 milliohms and is rated for many mating cycles, supporting modular daughtercard replacement and field servicing workflows in telecommunications, defense, and industrial computing platforms where long connector service life is required.
How does the SFM-138-L2-S-D-A-K compare to the larger SFM-149 series in terms of position count and typical application?
The SFM-138-L2-S-D-A-K provides 76 positions versus 98 positions for the SFM-149 series, both at 0.050" (1.27 mm) pitch dual-row configuration. The 76-position SFM-138 is chosen for designs requiring fewer than 80 signal and power circuits, such as mid-size FPGA mezzanine cards or 64-bit bus expansion modules, while the 98-position SFM-149 is preferred for larger FPGAs or high-channel ADC boards needing more than 80 pins in the same compact 1.27 mm pitch footprint.
What are the SMT assembly requirements for soldering the SFM-138-L2-S-D-A-K onto a PCB?
The SFM-138-L2-S-D-A-K requires surface mount reflow soldering with a peak temperature of up to 260°C, compatible with SAC305 lead-free solder alloy. Its 0.050" (1.27 mm) pitch pads require a precision laser-cut stencil with 0.5 mm apertures and 0.12 mm stencil thickness to deposit the correct solder paste volume across all 76 SMT pads, ensuring consistent joint formation during automated reflow without bridging between the closely spaced 1.27 mm pitch contacts.
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