SFM-138-L2-H-D-LC SAMTEC Connector (Other) In Stock
Samtec SFM-138-L2-H-D-LC is a 76-position dual-row surface-mount socket strip at 0.050" (1.27 mm) pitch with high-mating-height (H) variant for high-reliability board-to-board interconnects. Designed for demanding mezzanine applications in industrial and telecommunications systems. Available in stock with competitive pricing and worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- SFM-138-L2-H-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-138-L2-H-D-LC?
- 76-position dual-row SMT socket at 0.050" (1.27 mm) pitch delivering 38 contacts per row for high pin-count mezzanine interconnects
- High mating height (H) variant accommodating taller component clearances between stacked PCB assemblies
- Samtec SFM series high-reliability construction suitable for industrial, defense, and telecommunications board applications
What is SFM-138-L2-H-D-LC used for?
The SFM-138-L2-H-D-LC serves high pin-count mezzanine interconnect applications in FPGA carrier boards, server blade systems, and industrial embedded computing platforms requiring 76-pin dual-row connectivity. Its 0.050" pitch high-mating-height design accommodates taller component clearances between stacked boards, enabling flexible PCB assembly configurations. Telecommunications infrastructure and data acquisition systems rely on this connector for reliable multi-channel signal distribution.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-138-L2-H-D-LC datasheet?
SFM-138-L2-H-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-138-L2-H-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the H suffix indicate in the SFM-138-L2-H-D-LC, and how does it affect PCB stack height?
The H suffix designates a high mating height variant in Samtec's SFM series. This increased mating height creates more clearance between two stacked PCBs compared to standard or low-profile variants, accommodating taller components such as heatsinks, capacitors, or modules mounted on the mezzanine board within 76-pin dual-row configurations.
How many total contact positions does the SFM-138-L2-H-D-LC provide, and what pitch does it use?
The SFM-138-L2-H-D-LC provides 76 total positions arranged in a dual-row layout at 0.050" (1.27 mm) pitch, giving 38 contacts per row. This high contact count at fine pitch enables dense parallel bus routing, multi-channel analog, and differential pair signaling in mezzanine board applications.
Which high-density applications are best served by the 76-position SFM-138-L2-H-D-LC over smaller pin-count connectors?
Applications requiring parallel bus interfaces wider than 32 bits, multi-channel FPGA I/O expansion, or combined power and signal routing across a mezzanine board benefit most from the 76-position count. High-speed data acquisition boards, FPGA carrier cards with 38 differential pairs, and server blade interconnects needing more than 64 pins per connector are ideal use cases for the SFM-138-L2-H-D-LC.
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