SFM-138-L2-F-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-138-L2-F-D-A-K is a 76-position dual-row high-reliability surface-mount socket strip with 0.050-inch (1.27 mm) pitch and gold-plated female micro-terminal contacts. It delivers secure low-insertion-force board-to-board mating rated for 200+ mate cycles. Available in stock from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- SFM-138-L2-F-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 76-position dual-row SMT socket on 1.27 mm (0.050-inch) pitch providing dense board-to-board signal routing in compact mezzanine card and expansion module designs
- High-reliability gold-plated micro-terminal contacts rated for 200+ mate-unmate cycles with contact resistance below 20 milliohms ensuring long service life
- L2-F termination variant with right-angle or flush tail configuration enables edge-mount or low-profile PCB installation options for height-constrained assemblies
Applications
The SFM-138-L2-F-D-A-K is designed for high-density board-to-board interconnect in FPGA mezzanine modules, high-speed expansion cards, and industrial backplane systems that require 76 signal connections at 1.27 mm pitch with minimal PCB footprint. Its SMT construction integrates into automated lead-free reflow assembly processes, reducing manufacturing steps versus through-hole alternatives. The high-reliability contacts also suit ruggedized embedded computing platforms where connectors undergo repeated insertion cycles during field servicing or system configuration.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the SFM-138-L2-F-D-A-K provide, and what is the contact current rating at 1.27 mm pitch?
The SFM-138-L2-F-D-A-K provides 76 positions in a dual-row layout on a 1.27 mm (0.050-inch) pitch. Each gold-plated micro-terminal contact is rated to carry up to 1 A continuous current with a specified contact resistance below 20 milliohms, enabling it to handle both signal and light auxiliary power lines across the board-to-board interface.
What does the L2-F suffix indicate in the SFM-138-L2-F-D-A-K, and how does it differ from standard SFM tail options?
In SAMTEC's SFM series, L2 denotes a low-profile or alternative tail length variant while F indicates a flush or right-angle tail geometry. Compared to the standard vertical T1 tail, the L2-F configuration reduces the connector height above the PCB by approximately 1 mm to 2 mm, which is valuable in stacked board assemblies where total card-to-card stack height must be minimized below 10 mm.
For a 76-signal FPGA mezzanine design, why select the SFM-138-L2-F-D-A-K over a standard 2.54 mm pitch dual-row socket?
At 1.27 mm pitch, the SFM-138-L2-F-D-A-K occupies approximately half the board edge length compared to a 2.54 mm pitch socket with the same 76 positions, saving roughly 48 mm of connector span. This space saving is critical for FPGA mezzanine and FMC-compatible card designs where multiple high-pin-count connectors must fit within a 69 mm or 149 mm card edge defined by the VITA 57.1 FMC standard.
What is the maximum reflow temperature the SFM-138-L2-F-D-A-K can withstand, and how many reflow passes are permitted?
The SFM-138-L2-F-D-A-K supports lead-free SMT reflow soldering at peak temperatures up to 260°C in compliance with IPC/JEDEC J-STD-020 requirements. The connector housing withstands up to 3 consecutive reflow passes without warping or contact displacement, accommodating double-sided SMT assembly and rework processes typical in high-density PCB production environments.
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