SFM-138-02-SM-D-A-K SAMTEC Connector (Other) In Stock
The SFM-138-02-SM-D-A-K is a 76-position dual-row high-reliability surface-mount socket strip from SAMTEC with 0.050-inch pitch for dense board-to-board signal interfaces. It is designed for demanding applications where signal integrity and mating reliability across many cycles are critical. Available from stock worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- SFM-138-02-SM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 76 positions in a dual-row layout at 0.050-inch (1.27 mm) pitch enables very high pin density interconnects in compact SMT designs
- High-reliability socket construction maintains consistent contact force and low contact resistance across thousands of mating and unmating cycles
- Surface-mount termination supports automated reflow assembly, reducing PCB fabrication cost compared to through-hole alternatives
Applications
The SFM-138-02-SM-D-A-K is suited for high-density board-to-board signal connections in aerospace, defense, and industrial computing applications requiring 76 pins at 0.050-inch pitch. Its high-reliability contact design makes it appropriate for mezzanine card interconnects, embedded computing modules, and rugged backplane systems subject to vibration and thermal cycling. The connector is also used in test and measurement equipment and FPGA daughter card applications where reliable multi-signal mating integrity is essential.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact pitch and pin count does the SFM-138-02-SM-D-A-K offer for high-density board-to-board interfaces?
The SFM-138-02-SM-D-A-K features 76 contact positions arranged in a dual row at 0.050-inch (1.27 mm) pitch, providing a high pin density footprint compatible with SAMTEC SFM-series mating headers for compact surface-mount mezzanine and daughter card interconnects in industrial and aerospace electronics.
How does the high-reliability socket design of SFM-138-02-SM-D-A-K benefit applications with frequent mating cycles?
The high-reliability contacts of the SFM-138-02-SM-D-A-K maintain stable contact resistance and consistent insertion force across thousands of mating cycles, making it suitable for test fixtures, removable daughter cards, and field-replaceable modules where connector durability over the product lifetime is a key requirement.
For a rugged embedded computing module, what assembly method does SFM-138-02-SM-D-A-K support?
The SFM-138-02-SM-D-A-K uses surface-mount termination compatible with standard SMT reflow assembly, eliminating the need for through-hole drilling on 76 pads. This simplifies PCB fabrication, supports fully automated pick-and-place placement, and enables dense two-sided PCB population typical of rugged embedded computing and mezzanine module designs.
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