SFM-138-02-S-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-138-02-S-D-A-P is a 76-position, dual-row high-reliability socket strip with a 0.050" (1.27 mm) pitch in a surface mount configuration. Engineered for high-density mezzanine board stacking requiring 76 signal paths in a compact SMT footprint. Available in stock worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- SFM-138-02-S-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 76-position dual-row 0.050" pitch high-reliability SMT socket strip delivers maximum signal density for mezzanine and module stacking
- High-reliability contact design ensures stable mating force and low contact resistance across all 76 positions over extended mating cycles
- Surface mount construction enables automated reflow assembly with precise coplanarity across the 0.050" pitch dual-row footprint
Applications
The SFM-138-02-S-D-A-P is designed for high-density mezzanine interconnects in FPGA daughtercards, DSP signal processing modules, and high-reliability embedded computing platforms that require 76 signal paths routed through a single fine-pitch connector. Its 0.050" pitch dual-row SMT design is ideal for aerospace, defense, and advanced industrial applications where maximizing signal count per unit board area is a primary design constraint.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does SFM-138-02-S-D-A-P provide, and what is its contact pitch?
The SFM-138-02-S-D-A-P provides 76 positions arranged in a dual-row layout with a 0.050" (1.27 mm) pitch. This configuration allows 76 independent signal paths — including data, power, and control lines — to be routed through a single compact SMT socket, making it one of the highest-density standard pitch mezzanine socket strips available for FPGA and DSP board stacking.
For an aerospace signal processing board, why is SFM-138-02-S-D-A-P's high-reliability rating important at 0.050" pitch?
At 0.050" pitch with 76 positions, contact misalignment or normal-force degradation can cause intermittent failures across multiple signal lanes simultaneously. The high-reliability contact design of SFM-138-02-S-D-A-P maintains consistent normal force and low contact resistance across all 76 positions through thermal cycling from -55°C to +125°C and mechanical vibration, which is critical for avionics and satellite payload boards operating continuously for years without maintenance.
When would an engineer choose SFM-138-02-S-D-A-P over a lower-position-count alternative like a 50-position 0.050" pitch socket?
An engineer would choose the 76-position SFM-138-02-S-D-A-P over a 50-position socket when the mezzanine interface carries more than 50 signals — for example, a 32-bit data bus plus 16-bit address bus plus control, power, and ground lines simultaneously. Using a single 76-position connector versus two 38-position connectors reduces the connector footprint overhead and eliminates the alignment complexity of staggering multiple 0.050" pitch dual-row sockets on the same board edge.
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