SFM-138-02-LM-D-A-P SAMTEC Connector (Other) In Stock

SAMTEC SFM-138-02-LM-D-A-P is a 76-position, dual-row, .050-inch pitch surface-mount socket strip with high-reliability contacts designed for dense mezzanine card and board-to-board interconnect applications.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
SFM-138-02-LM-D-A-POther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
76
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 76-position dual-row layout on .050-inch pitch for high-density surface-mount board interconnect
  • High-reliability socket design with precision contacts ensuring consistent electrical performance over many mating cycles
  • Surface-mount termination compatible with standard SMT reflow processes for automated PCB assembly

Applications

The SFM-138-02-LM-D-A-P is designed for mezzanine card attachment, daughter-board connections, and FPGA expansion modules where 76 signals must be routed in a compact .050-inch pitch footprint. Its dual-row surface-mount configuration suits high-density backplane designs and embedded computing systems that require reliable signal integrity in space-constrained environments.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Datasheet

SFM-138-02-LM-D-A-P Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How many signals can the SFM-138-02-LM-D-A-P accommodate in a mezzanine card design?

The SFM-138-02-LM-D-A-P provides 76 positions arranged in a dual-row configuration on a .050-inch (1.27 mm) pitch, allowing engineers to route up to 76 individual signal, power, or ground connections in a compact surface-mount footprint suitable for high-density mezzanine card interfaces.

What PCB assembly process is compatible with the SFM-138-02-LM-D-A-P socket strip?

The SFM-138-02-LM-D-A-P uses surface-mount termination, making it compatible with standard SMT reflow soldering processes. It can be placed by automated pick-and-place equipment and reflowed in a standard convection oven profile, integrating seamlessly into high-volume PCB manufacturing lines without manual soldering.

When should a designer choose SFM-138-02-LM-D-A-P over a through-hole socket strip for an FPGA expansion board?

A designer should choose the SFM-138-02-LM-D-A-P when board thickness restrictions or double-sided component placement prevent through-hole mounting. The SMT format keeps the 76-position, .050-inch pitch connector on the surface layer, saving Z-height and allowing components to be placed on both sides of the PCB for maximum routing density in FPGA expansion applications.

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About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
Contact for Price
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pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

MR
Marco Rossi
CTO, AutoDrive Systems, Italy