SFM-138-02-LM-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-138-02-LM-D-A-P is a 76-position, dual-row, .050-inch pitch surface-mount socket strip with high-reliability contacts designed for dense mezzanine card and board-to-board interconnect applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- SFM-138-02-LM-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 76-position dual-row layout on .050-inch pitch for high-density surface-mount board interconnect
- High-reliability socket design with precision contacts ensuring consistent electrical performance over many mating cycles
- Surface-mount termination compatible with standard SMT reflow processes for automated PCB assembly
Applications
The SFM-138-02-LM-D-A-P is designed for mezzanine card attachment, daughter-board connections, and FPGA expansion modules where 76 signals must be routed in a compact .050-inch pitch footprint. Its dual-row surface-mount configuration suits high-density backplane designs and embedded computing systems that require reliable signal integrity in space-constrained environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signals can the SFM-138-02-LM-D-A-P accommodate in a mezzanine card design?
The SFM-138-02-LM-D-A-P provides 76 positions arranged in a dual-row configuration on a .050-inch (1.27 mm) pitch, allowing engineers to route up to 76 individual signal, power, or ground connections in a compact surface-mount footprint suitable for high-density mezzanine card interfaces.
What PCB assembly process is compatible with the SFM-138-02-LM-D-A-P socket strip?
The SFM-138-02-LM-D-A-P uses surface-mount termination, making it compatible with standard SMT reflow soldering processes. It can be placed by automated pick-and-place equipment and reflowed in a standard convection oven profile, integrating seamlessly into high-volume PCB manufacturing lines without manual soldering.
When should a designer choose SFM-138-02-LM-D-A-P over a through-hole socket strip for an FPGA expansion board?
A designer should choose the SFM-138-02-LM-D-A-P when board thickness restrictions or double-sided component placement prevent through-hole mounting. The SMT format keeps the 76-position, .050-inch pitch connector on the surface layer, saving Z-height and allowing components to be placed on both sides of the PCB for maximum routing density in FPGA expansion applications.
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