SFM-138-02-L-D-A-P SAMTEC Connector (Other) In Stock

SAMTEC SFM-138-02-L-D-A-P is a 76-position, dual-row, surface-mount socket strip with 0.050-inch (1.27 mm) pitch, offering high-reliability interconnection for board-to-board and mezzanine designs in compact, high-density PCB applications.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
SFM-138-02-L-D-A-POther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
76
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 76 positions in a dual-row configuration for high-density board-to-board signal routing
  • 0.050 inch (1.27 mm) pitch enables compact SMT footprint for space-constrained PCB designs
  • High-reliability socket construction with secure contact retention for industrial applications
  • Surface-mount termination compatible with standard reflow soldering profiles
  • Dual-row layout balances signal density and mechanical stability for mezzanine interconnects

Applications

The SFM-138-02-L-D-A-P is used in high-density mezzanine and board-to-board interconnect applications such as FPGA expansion modules, test and measurement instruments, and embedded computing platforms. Its 76-position, dual-row, 0.050-inch pitch design maximizes signal count in a minimal PCB area, making it a preferred choice for data acquisition cards and industrial I/O boards. The surface-mount format integrates seamlessly into automated SMT assembly lines for high-volume production.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Datasheet

SFM-138-02-L-D-A-P Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How does the SFM-138-02-L-D-A-P's 76-position dual-row layout compare to single-row connectors for high-density designs?

The SFM-138-02-L-D-A-P provides 76 contact positions in a dual-row arrangement at 0.050-inch (1.27 mm) pitch, delivering twice the pin density per linear board length compared to a single-row socket of the same pitch. This makes it advantageous for FPGA I/O expansion boards and data acquisition modules where PCB real estate is limited.

Which SAMTEC header series mates with SFM-138-02-L-D-A-P to create a complete board stacking assembly?

The SFM-138-02-L-D-A-P is designed to mate with SAMTEC TSM and TFC series headers that share the 0.050-inch (1.27 mm) pitch standard. These header families are available in various stack heights, allowing system designers to set board separation from a few millimeters up to 15 mm or more to accommodate components mounted between the two boards.

What soldering process is recommended for assembling SFM-138-02-L-D-A-P on a PCB, and are there coplanarity requirements?

The SFM-138-02-L-D-A-P is designed for surface-mount reflow soldering. Coplanarity of the SMT leads must be within 0.1 mm to ensure all 76 positions make solid solder joints simultaneously. A standard lead-free reflow profile with a peak temperature of approximately 260°C for under 30 seconds is appropriate for this connector family.

In long-lifecycle industrial programs, how should procurement teams manage sourcing risk for the SFM-138-02-L-D-A-P?

For long-lifecycle industrial programs, procurement teams should confirm the active status of the SFM-138-02-L-D-A-P at SAMTEC and establish blanket purchase orders at authorized distributors. Fine-pitch, high-position-count connectors with 76 positions at 0.050 inch pitch can carry lead times of 8 to 16 weeks during supply constraints, so safety stock equivalent to 3 to 6 months of consumption is a common planning target.

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AvailabilityIn Stock
Reference Price (USD)
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pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

MR
Marco Rossi
CTO, AutoDrive Systems, Italy