SFM-138-02-H-D-A-P SAMTEC Connector (Other) In Stock
SFM-138-02-H-D-A-P is a SAMTEC high-reliability 76-position dual-row socket strip at 0.050 inch (1.27 mm) pitch with a high-profile mating height and surface mount termination. It provides 152 total mated contacts in a compact SMT footprint for demanding mezzanine and board-stacking applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- SFM-138-02-H-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 76-position dual-row socket at 0.050 inch (1.27 mm) pitch delivering 152 total mated contacts, enabling very high signal density for complex FPGA, DSP, and SoC daughter board interfaces
- High-profile (H) mating height increases board-to-board clearance to accommodate tall passive components, heat spreaders, or flex cables in the inter-board space
- High-reliability SFM contact spring system provides consistent normal force and low contact resistance across thousands of mating cycles for aerospace, defense, and industrial applications
Applications
The SFM-138-02-H-D-A-P is used in complex high-pin-count mezzanine interfaces for FPGA-based signal processing boards, software-defined radio modules, and high-performance embedded computing platforms requiring 76 positions at 0.050 inch pitch. Its high-profile housing supports system designs where tall components such as voltage regulators, bulk capacitors, or cooling hardware occupy the inter-board space between the host and daughter PCBs. Applications include radar signal processors, LIDAR data acquisition modules, and network packet processing cards where maximum contact density per unit area is essential.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What total mated contact count does SFM-138-02-H-D-A-P provide, and how does this compare to lower-position SFM variants?
SFM-138-02-H-D-A-P provides 76 positions per connector in a dual-row arrangement at 0.050 inch (1.27 mm) pitch, yielding 152 total mated contacts. Compared to the 48-position SFM-124 variant (96 mated contacts) or the 56-position SFM-128 variant (112 mated contacts), the 76-position SFM-138 adds 40 to 56 more mated contacts. This additional capacity accommodates wider parallel data buses, extra power and ground contacts, or multiple independent high-speed interfaces on a single connector footprint without requiring a second connector.
For a LIDAR point-cloud processing board stacking an FPGA module over a power management PCB, why is the high-profile (H) option on SFM-138-02-H-D-A-P important?
LIDAR processing boards commonly place large bulk capacitors (10 µF to 100 µF), power inductors, or DC-DC converter modules on the host PCB close to the FPGA power pins. These components can be 6 mm to 12 mm tall, which would collide with a standard-profile socket. The high-profile (H) option on SFM-138-02-H-D-A-P increases the board-to-board gap to clear these tall components, eliminating the need to relocate power circuitry away from the FPGA decoupling network and preserving the intended PDN topology.
Can SFM-138-02-H-D-A-P handle high-speed differential signals, and what impedance environment does the 0.050 inch pitch support?
Yes, SAMTEC SFM-series connectors at 0.050 inch (1.27 mm) pitch are characterized for differential signal transmission at multi-Gbps data rates. The 1.27 mm contact spacing provides sufficient pitch to route 100-ohm differential pairs between adjacent signal contacts while assigning interleaved ground contacts, maintaining controlled impedance from the host PCB through the connector and onto the daughter card. SAMTEC publishes S-parameter data for the SFM series showing acceptable insertion loss below -1 dB and return loss better than -15 dB at frequencies up to several GHz, supporting interfaces such as JESD204B, LVDS, and SGMII.
What procurement format is SFM-138-02-H-D-A-P available in, and how does the absence of a TR suffix affect ordering strategy for production volumes?
SFM-138-02-H-D-A-P does not carry the -TR tape-and-reel suffix, which means it is supplied in tray or bulk packaging rather than on tape-and-reel. For automated SMT pick-and-place production requiring hundreds or thousands of units per run, buyers should confirm with SAMTEC or distributors whether a tape-and-reel equivalent (SFM-138-02-H-D-A-P-TR) is available, as tray-packed connectors typically require a manual load step or tray feeder on the pick-and-place machine. For prototype or low-volume builds of fewer than 100 units, tray packaging is often more cost-effective since it avoids the minimum reel quantity requirement common with TR-suffix parts.
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