SFM-138-02-F-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-138-02-F-D-A-P is a 76-position dual-row high-reliability socket strip with a 0.050 inch pitch for fine-pitch surface-mount applications. Designed for high-density mezzanine and board-to-board interconnects in demanding networking, FPGA, and embedded computing platforms. The compact 0.050 inch pitch enables 76 contacts in a minimal PCB footprint, supporting high-speed digital signal routing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- SFM-138-02-F-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 76 positions in a dual-row configuration on a 0.050 inch pitch for ultra-dense connectivity
- High-reliability socket strip construction rated for demanding telecom and defense applications
- Surface-mount (F) termination style for standard SMT reflow soldering compatibility
- 0.050 inch fine pitch delivers high contact density while minimizing connector body length
- Compatible with SAMTEC SHF and complementary 0.050 inch pitch header mating series
Applications
SFM-138-02-F-D-A-P serves high-density mezzanine board interconnect applications in FPGA carrier boards, networking ASICs, and embedded computing modules where 76 contacts at 0.050 inch pitch are required. Its surface-mount termination integrates into standard reflow soldering processes without through-hole drilling, benefiting complex multilayer PCB fabrication. High-reliability construction makes this socket strip appropriate for telecom rack equipment, industrial automation controllers, and defense systems requiring extended operational life.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact count and pitch does the SFM-138-02-F-D-A-P provide for high-density interconnect designs?
The SFM-138-02-F-D-A-P provides 76 positions on a 0.050 inch (1.27 mm) pitch in a dual-row layout. At this fine pitch, the connector body is roughly half the length of an equivalent 0.100 inch pitch part, allowing designers to fit 76 signal contacts into a very compact PCB footprint for FPGA daughter cards, networking line cards, and mezzanine module designs.
How does the SFM-138 series high-reliability rating benefit long-lifecycle industrial or defense applications?
SAMTEC's high-reliability SFM series connectors are designed to meet the demanding mating cycle, vibration, and environmental requirements of defense electronics, industrial automation, and telecom infrastructure. The 76-pin socket strip construction supports repeated mating and unmating across extended temperature ranges, helping ensure signal integrity throughout a product lifecycle that may span 10 or more years in the field.
What is the procurement lead time and minimum order consideration for SFM-138-02-F-D-A-P in production builds?
Fine-pitch high-reliability SAMTEC connectors such as the 76-position SFM-138-02-F-D-A-P often carry lead times of 6 to 12 weeks for standard stock quantities. Procurement teams supporting production builds of 500 or more units should establish blanket orders and buffer stock to prevent line shortages, and should also validate pin-compatible alternate SAMTEC SFM variants in case primary packaging becomes constrained.
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