SFM-137-T2-STL-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-137-T2-STL-D-A-P is a 74-position, dual-row, surface-mount high-reliability socket strip with 0.050-inch (1.27 mm) pitch, engineered for dense board-to-board and mezzanine interconnect in electronics requiring stable, high-contact-integrity connections.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- SFM-137-T2-STL-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 74 positions in a dual-row SMT layout at 0.050 inch (1.27 mm) pitch for high pin-count board-to-board connections
- High-reliability socket strip construction ensures consistent mating force and contact retention
- Surface-mount format supports automated reflow assembly on standard SMT production lines
- Compatible with SAMTEC TFC and TSM header families sharing the 0.050 inch pitch standard
- Dual-row design optimizes signal density while maintaining board mechanical stability
Applications
The SFM-137-T2-STL-D-A-P serves high-density board-to-board and mezzanine interconnect needs in applications such as FPGA development modules, embedded computing single-board computers, and data acquisition daughterboards requiring 74-position dual-row connectivity. Its 0.050-inch pitch SMT format makes it a fit for compact industrial control modules and telecom line cards where PCB space is limited and reliable multi-cycle mating performance is essential. The high-reliability rating supports long product lifetimes in industrial and test equipment environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many contacts does SFM-137-T2-STL-D-A-P provide, and what pitch does the dual-row layout use?
The SFM-137-T2-STL-D-A-P provides 74 contact positions arranged in a dual-row configuration at 0.050-inch (1.27 mm) pitch. This layout supports high signal density for board-to-board applications such as FPGA I/O expansion, data acquisition, and embedded computing modules, while remaining compatible with standard SMT assembly equipment and reflow soldering profiles.
How does SFM-137-T2-STL-D-A-P compare to SFM-138 and SFM-145 variants when selecting the right position count for a design?
The SFM-137-T2-STL-D-A-P has 74 positions, compared to 76 positions for the SFM-138 and 90 positions for the SFM-145, all at 0.050-inch (1.27 mm) pitch. Engineers select the 74-position variant when the signal bus width requires exactly 37 pins per row, avoiding unnecessary PCB footprint from the higher-position variants and reducing connector cost in medium-density mezzanine designs.
What mating headers are compatible with SFM-137-T2-STL-D-A-P for creating a complete stacked board assembly?
The SFM-137-T2-STL-D-A-P mates with SAMTEC TFC and TSM series headers sharing the 0.050-inch (1.27 mm) pitch and corresponding 74-position dual-row layout. These header families offer stack height options ranging from approximately 4 mm to 15 mm, giving designers flexibility to accommodate through-board components or cooling structures between the mated boards.
For a program with a 7-year service life, what RoHS and lifecycle considerations apply to procuring SFM-137-T2-STL-D-A-P?
The SFM-137-T2-STL-D-A-P is an active SAMTEC product and RoHS-compliant. For 7-year lifecycle programs, procurement teams should verify continued active status at time of design lock, confirm that the lead-free surface finish meets the program's soldering and operating temperature requirements up to 85°C, and establish supply agreements to manage the 8-to-16-week lead times typical of high-position-count, fine-pitch SMT connectors during periods of high demand.
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