SFM-137-T2-SM-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-137-T2-SM-D-A-P is a 74-position, dual-row, high-reliability socket strip with 1.27 mm (0.050 inch) pitch designed for surface mount assembly. Delivering 148 total contacts in a fine-pitch dual-row configuration, it is engineered for high-density mezzanine sockets, FPGA expansion cards, and communications backplane applications demanding compact and reliable interconnect.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- SFM-137-T2-SM-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-137-T2-SM-D-A-P?
- 74-position dual-row configuration at 1.27 mm (0.050 inch) pitch providing 148 total contacts
- High-reliability SFM series with gold-plated contacts rated for multiple mating cycles
- Surface mount termination compatible with standard lead-free SMT reflow processes up to 260°C
- Fine-pitch dual-row layout maximizes signal density in compact mezzanine and daughtercard PCB footprints
- T2 contact style provides enhanced mechanical retention for vibration-resistant board-to-board connections
What is SFM-137-T2-SM-D-A-P used for?
The SFM-137-T2-SM-D-A-P is used in FPGA mezzanine sockets, telecom line card interconnects, and high-density backplane assemblies where 148 contacts at 1.27 mm pitch are required in a compact surface mount form factor. It is well-suited for industrial computing platforms, test and measurement systems, and communications infrastructure modules that require reliable fine-pitch board-to-board connectivity. The T2 contact design provides additional mechanical stability in vibration-prone environments such as aerospace and industrial automation equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-137-T2-SM-D-A-P datasheet?
SFM-137-T2-SM-D-A-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-137-T2-SM-D-A-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the total contact count and pitch of the SFM-137-T2-SM-D-A-P, and what connector footprint does this create?
The SFM-137-T2-SM-D-A-P provides 148 total contacts arranged in 74 dual-row positions at 1.27 mm (0.050 inch) pitch. This results in a connector footprint approximately 47 mm in length, suitable for compact mezzanine board sockets and high-density FPGA expansion interfaces where board space is limited.
What does the T2 contact designation mean for the SFM-137-T2-SM-D-A-P in vibration-prone environments?
The T2 contact style in the SFM-137-T2-SM-D-A-P refers to an enhanced contact geometry that increases the normal force applied to mating pins, improving mechanical retention under vibration. This makes the connector suitable for industrial automation, aerospace, and transportation electronics where PCB assemblies may be exposed to continuous vibration levels above 5 g.
How does the 0.050 inch pitch of the SFM-137-T2-SM-D-A-P benefit high-speed signal integrity compared to 0.100 inch pitch connectors?
At 1.27 mm (0.050 inch) pitch, the SFM-137-T2-SM-D-A-P achieves twice the contact density of 2.54 mm pitch connectors, reducing interconnect length and parasitic capacitance. This supports higher signal speeds and is compatible with differential pair routing at frequencies up to several gigahertz, making it preferred for high-speed data buses in FPGA and communications designs.
Is the SFM-137-T2-SM-D-A-P available in tape-and-reel packaging for automated SMT production?
The SFM-137-T2-SM-D-A-P with the -P suffix indicates tray or tape packaging options suitable for automated SMT pick-and-place assembly. The surface mount termination is compatible with standard lead-free reflow profiles peaking at 260°C, supporting RoHS-compliant high-volume manufacturing of industrial and communications PCB assemblies.
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