SFM-137-T2-LM-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-137-T2-LM-D-A-P is a 74-position, dual-row, 0.050 inch pitch high-reliability surface-mount socket strip with 148 total contacts, featuring a low-profile mount (LM) design and T2 stacking height. Ideal for compact mezzanine stacking in high-density FPGA and signal processing platforms. Available with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- SFM-137-T2-LM-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-137-T2-LM-D-A-P?
- 148 total contacts (74 positions, dual-row) on 0.050 inch (1.27 mm) pitch, providing exceptionally high I/O density for FPGA expansion, DSP mezzanine, and high-speed signal routing applications
- Low-profile mount (LM) construction minimizes the overall stacked board height compared to standard-height SFM variants, enabling slimmer chassis and enclosure designs for space-constrained systems
- High-reliability socket with gold-plated contacts and T2 stacking height specification, ensuring precise board separation and consistent contact engagement depth across the 148-pin interface
What is SFM-137-T2-LM-D-A-P used for?
The SFM-137-T2-LM-D-A-P is designed for high-density FPGA mezzanine boards, software-defined radio modules, and multi-channel data acquisition systems that require 148-pin board-to-board connectivity on a 0.050 inch pitch with minimal stack height. The low-profile mount design is particularly suited to compact enclosures, portable instruments, and rack-mounted equipment where board-to-board clearance is at a premium. Its gold-plated contacts and high-reliability construction support demanding applications with frequent board swaps or operation in harsh thermal environments from -40°C to +85°C.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-137-T2-LM-D-A-P datasheet?
SFM-137-T2-LM-D-A-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-137-T2-LM-D-A-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
For a software-defined radio platform needing 148 signal and power connections between two boards, how does the SFM-137-T2-LM-D-A-P's 0.050 inch pitch layout fit within a compact chassis?
At 0.050 inch (1.27 mm) pitch with 74 positions per row, the SFM-137-T2-LM-D-A-P spans approximately 93.5 mm in row length. This is substantially shorter than a 0.100 inch pitch connector carrying the same 148 contacts, which would require around 187 mm of row length. For a software-defined radio chassis constrained to a 100 mm wide PCB form factor, the 0.050 inch pitch dual-row SFM-137 fits within the board edge while a 0.100 inch pitch alternative would not.
What is the significance of the LM (low-profile mount) suffix on the SFM-137-T2-LM-D-A-P compared to a standard-height SFM variant for a slim enclosure design?
The LM (low-profile mount) suffix indicates a reduced unmated socket body height compared to standard SFM variants. This results in a lower overall mated stack height when paired with the corresponding T2 header, potentially reducing the board separation from a typical 8 mm to 11 mm down to approximately 5 mm to 7 mm depending on the specific configuration. In slim chassis or portable instruments with tight Z-axis constraints, the LM design allows two boards with tall components to fit within a restricted enclosure height that a standard-height socket would exceed.
How do the gold-plated contacts of the SFM-137-T2-LM-D-A-P support reliability in a 148-pin mezzanine interface subject to thermal cycling between -40°C and +85°C?
Gold plating on the 148 contacts of the SFM-137-T2-LM-D-A-P provides corrosion resistance and maintains stable contact resistance over thousands of thermal cycles between -40°C and +85°C. Unlike tin-plated contacts, which can develop oxide layers or fretting corrosion when micro-motion occurs during thermal expansion, gold contacts sustain low and predictable contact impedance across the full 148-pin interface. This is critical in high-speed signal paths where contact resistance variation of even a few milliohms can degrade signal quality or cause intermittent failures.
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