SFM-137-T2-LM-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-137-T2-LM-D-A-K is a 74-position dual-row high-reliability surface-mount socket strip at 0.050" (1.27 mm) pitch, providing secure board-to-board mating with a low-profile SMT footprint for space-constrained embedded designs. Gold-plated contacts deliver low insertion loss over the connector's rated mating cycles. Available worldwide from stock with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- SFM-137-T2-LM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 74-position dual-row socket at 0.050" (1.27 mm) pitch with T2 tail style for precise SMT coplanarity and reliable solder joint formation
- Gold-plated contacts provide low contact resistance below 20 mΩ and resist corrosion for extended service life in harsh environments
- High-reliability design supports thousands of mating cycles, ideal for test fixtures and frequently swapped processor or memory mezzanine modules
Applications
The SFM-137-T2-LM-D-A-K is designed for FPGA mezzanine cards, memory modules, and processor expansion boards where a 74-position 0.050" dual-row socket minimizes board space while maintaining signal integrity. It is widely deployed in embedded computing platforms, radar signal processors, and industrial control systems that require repeatable board-to-board connection across operating temperatures ranging from -55°C to +125°C. Its SMT tail style supports high-volume pick-and-place reflow assembly.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the T2 tail style on the SFM-137-T2-LM-D-A-K improve SMT solder joint reliability?
The T2 tail style provides a specific lead-form geometry that improves coplanarity across all 74 pins to within 0.10 mm, ensuring consistent solder paste contact during reflow. This reduces cold-joint defects in high-density SMT assembly compared to standard tail styles on 0.050" pitch connectors.
In which frequency or signal-integrity-sensitive applications can the 74-position SFM-137-T2-LM-D-A-K maintain performance?
The SFM-137-T2-LM-D-A-K maintains signal integrity for single-ended signals up to several hundred MHz and low-speed differential pairs. For designs requiring multi-Gbps performance across all 74 pins, engineers pair it with controlled-impedance PCB trace routing and bypass capacitors placed within 2 mm of the connector footprint.
What is the pin count difference between SFM-137-T2-LM-D-A-K and SFM-138-02-L-D-A-K, and when does that extra capacity matter?
The SFM-137-T2-LM-D-A-K has 74 pins versus 76 pins on the SFM-138-02-L-D-A-K, a difference of 2 positions. Those 2 extra contacts on the -138 variant matter when an interface definition requires 76 dedicated signal or power lines, such as certain FPGA expansion bus standards that allocate specific pins for power delivery at up to 1 A per contact pair.
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