SFM-137-T2-L-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-137-T2-L-D-A-P is a 74-position dual-row high-reliability socket strip with 0.050" pitch in a surface mount configuration. It features a T2 stacked height and precision contacts designed for high-cycle mating with consistent low insertion force. Available from authorized distributors worldwide for embedded and communications applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- SFM-137-T2-L-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 74-position dual-row 0.050" pitch layout provides maximum signal density for high-bandwidth board-to-board interfaces
- T2 controlled stack height enables repeatable board-to-board spacing in multi-board modular system designs
- High-reliability contact design supports hundreds of mating cycles for serviceable module and daughter card applications
Applications
The SFM-137-T2-L-D-A-P is used in high-density board-to-board interconnect for FPGA mezzanine cards, server blade daughter boards, and advanced telecommunications modules. Its 74-position dual-row layout at 0.050" pitch enables high pin count interfaces in space-constrained server and networking platforms where signal density and reliable mating cycles are essential for system performance.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 74-pin SFM-137-T2-L-D-A-P enable high-bandwidth interconnect compared to lower-count alternatives?
SFM-137-T2-L-D-A-P provides 74 pins in a dual-row 0.050" pitch footprint, delivering a high signal channel count in a compact surface mount area roughly equivalent to what a 0.100" pitch connector would use for only 37 pins. This doubled pin density supports high-bandwidth parallel data buses, multi-channel analog interfaces, and combined power-and-signal routing in FPGA mezzanine cards and advanced telecom daughter boards.
Which FPGA mezzanine or server blade platforms benefit most from SFM-137-T2-L-D-A-P at 0.050" pitch?
SFM-137-T2-L-D-A-P is particularly effective in FMC (FPGA Mezzanine Card) and AMC (Advanced Mezzanine Card) platforms where high pin count at 0.050" pitch is required to route parallel data buses and configuration signals between a carrier board and an FPGA module. The 74-position dual-row configuration supports signal counts typical of 16-bit or wider parallel interfaces and multi-channel sensor acquisition boards in server and communications equipment.
Is SFM-137-T2-L-D-A-P available in tape-and-reel or bulk packaging, and what does this mean for procurement?
SFM-137-T2-L-D-A-P does not carry the -TR tape-and-reel suffix, indicating it is supplied in bulk or tray packaging rather than continuous tape-and-reel. For procurement, this means it is typically suited for lower-volume or manual assembly operations rather than high-speed automated pick-and-place lines. Buyers requiring the 74-pin dual-row 0.050" pitch connector in tape-and-reel for automated SMT should check Samtec for a -TR variant or reel-on-request availability.
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