SFM-137-T2-L-D SAMTEC Connector (Other) In Stock
SAMTEC SFM-137-T2-L-D is a 74-position dual-row surface mount socket strip with 0.050-inch pitch, designed for high-reliability board-to-board and mezzanine stacking interconnect applications. Available with gold-plated contacts and compact SMT footprint for space-constrained PCB designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- SFM-137-T2-L-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 74-position dual-row SMT socket with 0.050" (1.27 mm) pitch for high-density interconnect
- High-reliability construction with gold-plated contacts rated for 500+ mating cycles
- Surface mount termination style enables automated PCB assembly and reflow soldering compatibility
- Compact low-profile form factor supports board-to-board and mezzanine stacking applications
Applications
The SFM-137-T2-L-D is used in high-density board-to-board stacking and mezzanine interconnect designs where 0.050-inch pitch and 74 dual-row positions are required. It is well suited for communications equipment, industrial computing modules, and embedded systems requiring reliable SMT socket connections. The gold-plated contacts and robust housing make it a common choice for aerospace, defense, and test-and-measurement instrumentation.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch and total pin count of the SFM-137-T2-L-D socket strip?
The SFM-137-T2-L-D features a 0.050-inch (1.27 mm) pitch and provides 74 positions arranged in a dual-row configuration, giving a total of 74 contacts for board-to-board interconnect applications. This high-density layout suits space-constrained SMT PCB designs.
Which PCB assembly processes are compatible with the SFM-137-T2-L-D surface mount socket?
The SFM-137-T2-L-D uses a surface mount termination style that is fully compatible with standard SMT reflow soldering processes. With a 0.050-inch pitch and dual-row footprint, it can be placed by automated pick-and-place equipment, supporting high-volume production workflows common in telecom and industrial computing boards.
How does the SFM-137-T2-L-D compare to a through-hole equivalent for mezzanine stacking?
Unlike through-hole socket strips, the SFM-137-T2-L-D offers a surface mount footprint that eliminates the need for drilled vias, saving board space and enabling finer layer routing. Its 0.050-inch pitch and 74-position dual-row layout deliver equivalent signal density to through-hole alternatives while supporting modern reflow assembly. The gold-plated contacts maintain contact resistance well below 20 mΩ across 500+ mating cycles.
In what applications is the SAMTEC SFM-137-T2-L-D most commonly used?
The SFM-137-T2-L-D is widely deployed in communications line cards, embedded computing modules, test-and-measurement instrumentation, and aerospace avionics backplanes. Its 74-position dual-row SMT configuration at 0.050-inch pitch supports high pin-count mezzanine connections where board real estate is limited and signal integrity at frequencies up to several hundred MHz is required.
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