SFM-137-T2-H-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-137-T2-H-D-A-P is a 74-position dual-row high-reliability socket strip at 0.050" pitch in a surface mount horizontal package with T2 standoff height. Engineered for high-pin-count mezzanine board-to-board applications requiring dense signal routing. Available from authorized distributors worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- SFM-137-T2-H-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-137-T2-H-D-A-P?
- 74-position dual-row socket at 0.050" pitch in a horizontal (H) surface mount orientation providing the highest density board-to-board mezzanine connectivity within a compact PCB footprint
- High-reliability SAMTEC SFM series precision contacts with T2 standoff defining a specific board-to-board separation suitable for controlled-clearance mezzanine stacking in rugged environments
- Dual-row SMT layout at 0.050" pitch accommodates 74 signal lines including differential pairs, power, and ground in a single connector footprint for high-speed data plane designs
What is SFM-137-T2-H-D-A-P used for?
The SFM-137-T2-H-D-A-P is intended for high-speed FPGA mezzanine cards, network processor daughterboards, and storage controller blades where 74 positions of reliable board-to-board connectivity must be maintained at 0.050" pitch in a horizontal SMT orientation. Its large pin count and high-reliability contact system support mixed differential signal, power, and control line routing across stacked PCBs in demanding telecom and computing platforms.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-137-T2-H-D-A-P datasheet?
SFM-137-T2-H-D-A-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-137-T2-H-D-A-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 74-position count of the SFM-137-T2-H-D-A-P compare to the 48-position SFM-124 series in routing capacity?
The SFM-137-T2-H-D-A-P provides 74 positions versus the 48 positions of the SFM-124 series, a 54% increase in pin count on the same 0.050" dual-row pitch. This additional capacity allows designers to route more high-speed differential pairs, additional power rails, or more ground returns in a single mezzanine connector interface without increasing the board-to-board stack footprint beyond one connector location.
In which high-speed signal integrity scenarios does the horizontal (H) orientation of SFM-137-T2-H-D-A-P offer an advantage over vertical-mount 0.050" sockets?
The horizontal (H) orientation positions the 74-position socket body parallel to the PCB surface, which reduces the overall board-to-board stack height and lowers the center of gravity of the mezzanine assembly. For high-speed differential pairs above 1 GHz, this lower-profile orientation can shorten the stub length on solder joints and reduce parasitic inductance compared to a tall vertical mount at the same 0.050" pitch.
What T2 standoff height means for thermal management between stacked PCBs using the SFM-137-T2-H-D-A-P?
The T2 standoff defines a specific fixed mechanical separation between the top and bottom PCBs in the mezzanine stack when the SFM-137-T2-H-D-A-P is mated. This defined air gap at 0.050" contact pitch allows forced-air or natural convection cooling to flow between the boards, preventing hot spots from components mounted near the 74-position connector footprint on either stacked PCB.
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About SAMTEC
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