SFM-137-T2-H-D-A SAMTEC Connector (Other) In Stock
SAMTEC SFM-137-T2-H-D-A is a 74-position, dual-row, high-reliability socket strip with 1.27 mm (0.050 inch) pitch designed for surface mount applications. The fine-pitch dual-row layout delivers high contact density for space-constrained board-to-board and mezzanine interconnects. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- SFM-137-T2-H-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 74 positions in dual-row 1.27 mm (0.050") pitch SMT format for maximum signal density in compact PCB areas
- High-reliability socket strip construction with precision contacts ensures consistent mating force and long cycle life
- Surface mount termination compatible with standard reflow soldering processes, reducing assembly time and cost
Applications
SFM-137-T2-H-D-A is ideal for mezzanine card interconnects in embedded computing, FPGA development boards, and compact instrumentation where 1.27 mm pitch is required. Its 74-position dual-row configuration supports simultaneous power and high-speed signal routing between stacked PCBs in military and aerospace electronics. The high-reliability socket strip design also fits rugged industrial controllers and medical imaging modules demanding stable electrical connections over extended service life.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the SFM-137-T2-H-D-A provide for high-density board interconnects?
The SFM-137-T2-H-D-A features a 1.27 mm (0.050 inch) pitch with 74 total positions arranged in 2 rows of 37 contacts each. This fine-pitch dual-row layout enables high-density board-to-board connections while occupying minimal PCB footprint compared to 2.54 mm pitch alternatives of equivalent position count.
Which industrial or defense applications benefit most from the high-reliability design of the SFM-137-T2-H-D-A?
Military embedded computing modules, avionics line-replaceable units, and rugged industrial controllers benefit most from the high-reliability socket strip construction. The connector is engineered to withstand mechanical shock, vibration, and temperature cycling across at least -55°C to +125°C, making it suitable for harsh-environment systems where connector failure is not acceptable.
How does the 1.27 mm pitch of the SFM-137-T2-H-D-A compare to standard 2.54 mm pitch connectors in terms of board space savings?
At 1.27 mm pitch, the SFM-137-T2-H-D-A occupies approximately 50% less board length than a comparable 2.54 mm pitch connector carrying the same 74 positions. This space reduction is critical in compact FPGA carrier boards, SOM baseplates, and high-channel-count data acquisition systems where every square millimetre of PCB area is at a premium.
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