SFM-137-L2-S-D-A-P-TR SAMTEC Connector (Other) In Stock
SFM-137-L2-S-D-A-P-TR is a 74-position dual-row high-reliability surface-mount socket strip from SAMTEC with 0.050-inch pitch. It delivers 74 channels of high-density connectivity with gold-plated contacts and press-fit board retention for secure mating. Available from stock worldwide in tape-and-reel packaging for automated SMT production.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- SFM-137-L2-S-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 74-position dual-row SMT socket at 0.050-inch (1.27 mm) pitch providing 74 signal channels in a compact footprint suitable for high-bandwidth mezzanine interconnects
- L2 high-reliability contact rating with gold-plated contact surfaces rated for extended mating cycles while maintaining contact resistance below 20 mOhm
- Press-fit (P) board retention feature mechanically anchoring the 74-position socket to the PCB during mating and unmating of high-pin-count daughtercard modules
Applications
The SFM-137-L2-S-D-A-P-TR is designed for high-pin-count mezzanine, FMC, and FPGA daughtercard interconnect applications in high-performance computing, defense signal processing, and advanced telecom line cards requiring 74 channels at 0.050-inch pitch. Its press-fit retention prevents connector lift-off during repeated plug-in module replacement in rack-mounted or airborne equipment subject to mechanical vibration. System integrators deploy this socket strip in data acquisition platforms, software-defined radio modules, and GPU accelerator mezzanine cards where maximum channel count in a minimum PCB footprint is essential.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What advantage does the press-fit (P) retention feature of the SFM-137-L2-S-D-A-P-TR provide over adhesive-only socket mounting?
The press-fit (P) retention clips on the SFM-137-L2-S-D-A-P-TR mechanically secure the 74-position socket body to the PCB with a hold-down force of several Newtons per clip, preventing the connector from lifting or tilting during 74-pin daughtercard extraction, which is critical in vibrating environments such as airborne equipment, vehicles, and server rack installations where mating forces can exceed 10 N.
How does the SFM-137-L2-S-D-A-P-TR compare in channel count to the SFM-109 for high-bandwidth FPGA mezzanine designs?
The SFM-137-L2-S-D-A-P-TR provides 74 positions versus 18 positions for the SFM-109, offering 56 additional channels at the same 0.050-inch pitch, which translates to up to 74 differential pairs or a mix of power, ground, and signal lanes needed for high-bandwidth FPGA mezzanine cards transferring data at 3 Gbps to 16 Gbps per channel on multi-lane SerDes interfaces.
Is the SFM-137-L2-S-D-A-P-TR suitable for reflow soldering, and what precautions apply to its 74-position SMT footprint?
Yes, the SFM-137-L2-S-D-A-P-TR is rated for standard SMT reflow profiles up to 260°C peak temperature per IPC/JEDEC J-STD-020, but the 74-position dual-row footprint spanning approximately 1.85 inches requires careful paste stencil design with 0.050-inch aperture spacing to prevent solder bridging between adjacent pads, and board support fixtures are recommended during reflow to maintain coplanarity across the full connector length.
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