SFM-137-L2-LM-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-137-L2-LM-D-A-P is a 74-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch and surface mount termination. It features low-profile board-stacking hardware and an anti-backout retention system for secure mating. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- SFM-137-L2-LM-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 74-position dual-row socket on 0.050" (1.27 mm) pitch delivering 74 contacts in a minimal PCB footprint
- High-reliability contact system rated for hundreds of mating cycles with consistent sub-milliohm contact resistance
- Anti-backout (A) feature preventing unintentional connector separation under vibration or lateral stress
- Surface mount (SM) termination enabling reflow soldering compatibility with standard automated PCB assembly processes
Applications
The SFM-137-L2-LM-D-A-P is designed for high-density mezzanine and daughterboard interconnects in FPGA modules, embedded computing platforms, and data acquisition systems requiring 74-pin dual-row socket connectivity at 1.27 mm pitch. The anti-backout retention and high-reliability contacts make it well suited to industrial and defense electronics exposed to shock and vibration. Its low-profile surface mount form factor integrates smoothly into compact multilayer PCB stacks.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many contact positions does the SFM-137-L2-LM-D-A-P provide, and how are they distributed across the two rows?
The SFM-137-L2-LM-D-A-P provides 74 positions arranged in a dual-row configuration with 37 contacts per row at a 0.050" (1.27 mm) center-to-center pitch. This layout allows 74 simultaneous signal or mixed signal-and-power connections in a footprint roughly half the size of an equivalent 0.100" pitch dual-row connector.
What function does the anti-backout (A) option serve in the SFM-137-L2-LM-D-A-P connector during field deployment?
The anti-backout feature is a mechanical retention element that resists axial pull-out forces once the mated connector pair is engaged, keeping all 74 pins in electrical contact under vibration, thermal cycling, or accidental cable tension. This is particularly valuable in industrial motor controllers and robotics platforms where mechanical stress can otherwise cause intermittent disconnects, leading to system faults or data corruption.
Why would a system designer select the SFM-137-L2-LM-D-A-P over a lower pin-count socket for an FPGA I/O expansion module?
FPGA I/O expansion modules often require 60 or more simultaneous digital and differential signal lines; the SFM-137-L2-LM-D-A-P's 74-position capacity accommodates high-speed LVDS pairs, single-ended I/Os, and power pins in a single connector interface. Consolidating these into one 74-pin, 1.27 mm pitch socket eliminates the board real estate and assembly cost of using two or three smaller connectors, while the dual-row layout keeps the connector length under 50 mm.
Does the SFM-137-L2-LM-D-A-P support lead-free soldering, and what reflow temperature profile is compatible?
Yes, the SFM-137-L2-LM-D-A-P is compatible with lead-free (Pb-free) reflow soldering at peak temperatures up to 260°C per IPC/JEDEC J-STD-020 guidelines. The surface mount termination pads are sized for a standard 0.050" SMT footprint, and the housing material withstands multiple reflow passes without deformation, ensuring the 74 pins remain coplanar within ±0.1 mm after soldering.
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