SFM-137-L2-L-D-A SAMTEC Connector (Other) In Stock
The SFM-137-L2-L-D-A is a 74-position dual-row surface-mount socket strip from SAMTEC with 0.050-inch pitch for high-reliability board interconnect. It provides a secure mezzanine or board-to-board interface suitable for dense PCB stacking assemblies. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- SFM-137-L2-L-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 74 positions in a dual-row, 0.050-inch pitch layout enabling high-density interconnection in compact PCB designs
- Surface-mount termination supports automated reflow assembly and robust solder joint reliability
- High-reliability construction rated for demanding vibration and thermal cycling environments
- SAMTEC SFM series compatibility allows flexible mating with standard SFM pin headers across board stacking heights
Applications
The SFM-137-L2-L-D-A is used in high-density board-to-board and mezzanine interconnect applications where a reliable 74-pin dual-row socket is needed on a 0.050-inch pitch. It is well suited for industrial computing modules, ruggedized embedded systems, and test fixtures requiring repeatable engagement across hundreds of mating cycles. The surface-mount format integrates cleanly into automated SMT production lines handling compact multi-board assemblies.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does the SFM-137-L2-L-D-A have, and what pitch does it use?
The SFM-137-L2-L-D-A has 74 positions arranged in a dual-row configuration on a 0.050-inch (1.27mm) pitch. This compact layout allows high-density signal routing in board-to-board interconnect applications where PCB real estate is at a premium.
What mounting style does the SFM-137-L2-L-D-A use, and how does it affect assembly processes?
The SFM-137-L2-L-D-A uses surface-mount termination, making it compatible with standard SMT reflow soldering processes. This eliminates the need for through-hole drilling in the PCB, reduces assembly time, and enables placement by pick-and-place machines handling 0.050-inch pitch components.
Which types of embedded and industrial systems commonly use the SFM-137-L2-L-D-A socket connector?
This socket is commonly used in COM Express modules, FPGA mezzanine cards, test and measurement fixtures, and industrial backplane assemblies. The 74-pin dual-row format at 0.050-inch pitch provides adequate signal density for high-speed parallel buses and multi-channel I/O interfaces in rugged 24/7 operating environments.
What is the mating compatibility of SFM-137-L2-L-D-A within the SAMTEC connector ecosystem?
The SFM-137-L2-L-D-A mates with SAMTEC TSM or SFM series dual-row pin headers at 0.050-inch pitch. This compatibility across the SAMTEC product family allows engineers to select different stacking heights—typically 8mm, 11mm, or custom—while maintaining consistent 74-pin electrical connectivity across board layers.
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