SFM-137-L2-FM-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-137-L2-FM-D-A-P is a 74-position dual-row high-reliability socket strip with 0.050" pitch for surface-mount board-to-board mezzanine connections. Features a floating mate (FM) design that tolerates up to ±0.5 mm PCB co-planarity misalignment during mating. Available worldwide in standard packaging for demanding signal integrity applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- SFM-137-L2-FM-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 74 positions in dual-row 0.050-inch pitch SMT layout for high-density mezzanine board stacking
- Floating mate (FM) design accommodates ±0.5 mm XY misalignment for easier PCB assembly alignment
- High-reliability gold-plated contacts rated for repeated insertion cycles in industrial environments
- Surface-mount footprint supports reflow soldering with standard SMT production processes
- Compatible with SAMTEC TSM and TFM header series for complete mezzanine stack solutions
Applications
The SFM-137-L2-FM-D-A-P is designed for mezzanine interconnect applications in embedded computing modules, FPGA daughter cards, and high-speed signal routing boards where 74 dual-row contacts at 0.050-inch pitch are required. The floating-mate feature makes it especially suitable for automated board assembly where slight PCB co-planarity variations between stacked boards must be absorbed without stressing solder joints or connector contacts.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the FM (floating mate) designation provide in the SFM-137-L2-FM-D-A-P for PCB assembly?
The FM (floating mate) feature allows the connector body to shift up to ±0.5 mm in the XY plane during mating, compensating for PCB co-planarity tolerance stack-up between two stacked boards. For a 74-position dual-row socket at 0.050-inch pitch, this float capability prevents contact damage and reduces solder joint stress during automated board-to-board assembly.
How many signal channels does the SFM-137-L2-FM-D-A-P support, and how dense is the connector footprint?
This connector provides 74 positions in a dual-row arrangement at 0.050-inch (1.27 mm) pitch, resulting in a board footprint of approximately 1.85 inches in length. The dual-row layout doubles the contact density compared to a single-row strip of the same length, enabling 74 signal channels in the space where a 0.100-inch pitch connector would fit only 18 contacts per row.
For an FPGA mezzanine application, how does this socket compare to a zero-float socket at the same pin count?
A floating-mate socket like the SFM-137-L2-FM-D-A-P is preferable when two PCBs are assembled onto a carrier without precision alignment fixtures, as its ±0.5 mm float absorbs the cumulative PCB fabrication and placement tolerances common in multi-board stacking. A zero-float 74-position socket requires tighter assembly fixturing, adding process cost; the floating mate version reduces that burden, especially in systems with 74-pin FPGA mezzanine cards inserted in the field.
Which SAMTEC header series mates with SFM-137-L2-FM-D-A-P for a complete 74-position board-to-board stack?
The SFM-137-L2-FM-D-A-P mates with SAMTEC TSM or TFM series dual-row headers at 0.050-inch pitch, forming a complete board-to-board interconnect with typical stack heights ranging from 8 mm to 20 mm depending on the selected header variant. Contact resistance in a properly mated pair is typically below 20 milliohms across 74 positions, suitable for signal and low-current power distribution.
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