SFM-137-L2-F-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-137-L2-F-D-A-P is a 74-position dual-row high-reliability surface mount socket strip with 0.050 inch (1.27 mm) pitch. It provides robust signal integrity for high-density PCB interconnects and is available in standard stock for worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- SFM-137-L2-F-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 74-position dual-row socket strip with 0.050 inch (1.27 mm) pitch for high-density signal routing
- Surface mount termination for automated SMT assembly compatibility
- High-reliability design engineered for demanding industrial and aerospace interconnect applications
- Dual-row configuration maximizes contact count in a compact PCB footprint
- Compatible with SAMTEC SFM series mating headers for a complete board-to-board solution
Applications
The SFM-137-L2-F-D-A-P is commonly deployed in high-density board-to-board interconnect systems for test and measurement equipment, military electronics, and data communication modules. Its 0.050 inch pitch and 74-position dual-row layout make it ideal for FPGA daughterboards, embedded computing modules, and high-speed digital backplanes requiring reliable multi-signal connectivity.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does the SFM-137-L2-F-D-A-P provide in its dual-row layout?
The SFM-137-L2-F-D-A-P provides 74 positions arranged in a dual-row configuration with 0.050 inch (1.27 mm) pitch, delivering a high contact density that supports complex multi-signal interconnects on compact PCB designs in industrial and computing applications.
Is the SFM-137-L2-F-D-A-P compatible with automated SMT assembly processes?
Yes, the SFM-137-L2-F-D-A-P uses a surface mount termination style, making it fully compatible with standard SMT pick-and-place and reflow solder processes. The 0.050 inch pitch layout enables accurate placement at high board densities, supporting volume production assembly workflows.
What applications benefit most from the SFM-137-L2-F-D-A-P's high-reliability socket strip design?
The SFM-137-L2-F-D-A-P is well-suited for FPGA mezzanine cards, test and measurement backplanes, and defense electronics where 74 positions with a 1.27 mm pitch must maintain signal integrity over extended operating temperature ranges from -55°C to +125°C.
What is the pitch of the SFM-137-L2-F-D-A-P and how does it compare to standard 2.54 mm connectors?
The SFM-137-L2-F-D-A-P uses a 0.050 inch (1.27 mm) pitch, which is exactly half the standard 2.54 mm connector pitch. This finer pitch allows 74 positions to fit in roughly the same board space that a 37-position 2.54 mm connector would require, enabling significant footprint savings.
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