SFM-137-02-ZZ-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-137-02-ZZ-D-A-K-TR is a 74-position dual-row high-reliability SMT socket strip with 0.050-inch pitch for dense board-to-board connections. It offers robust surface-mount termination with tape-and-reel packaging for automated assembly. Available globally with fast worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- SFM-137-02-ZZ-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-137-02-ZZ-D-A-K-TR?
- 74-position dual-row configuration at 0.050-inch pitch enables high-density signal routing in compact PCB layouts
- Surface-mount termination with tape-and-reel (TR) packaging supports high-volume automated pick-and-place assembly
- High-reliability SAMTEC SFM series construction rated for demanding vibration and thermal cycling environments
What is SFM-137-02-ZZ-D-A-K-TR used for?
The SFM-137-02-ZZ-D-A-K-TR is designed for high-density board-to-board interconnects in FPGAs, DSP evaluation boards, and test and measurement equipment where 74 signals must cross a mezzanine interface in a 0.050-inch pitch footprint. Its SMT format makes it suitable for automated assembly in industrial computing modules, communication blades, and military/aerospace electronics requiring compact form factors. The tape-and-reel packaging enables seamless integration into high-volume PCB production lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-137-02-ZZ-D-A-K-TR datasheet?
SFM-137-02-ZZ-D-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-137-02-ZZ-D-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does the SFM-137-02-ZZ-D-A-K-TR provide, and what pitch does it use?
The SFM-137-02-ZZ-D-A-K-TR offers 74 positions arranged in 2 rows on a 0.050-inch (1.27 mm) pitch. This dual-row layout allows routing of up to 74 signals across a compact board-to-board interface, making it an efficient choice for FPGA and processor mezzanine connections.
What assembly method and packaging format does SFM-137-02-ZZ-D-A-K-TR support for production environments?
The SFM-137-02-ZZ-D-A-K-TR uses surface-mount technology (SMT) termination and ships in tape-and-reel (TR) packaging. The TR format is compatible with standard 8mm to 32mm reel-fed pick-and-place machines, enabling throughput of hundreds of parts per hour in automated PCB assembly lines.
When would SFM-137-02-ZZ-D-A-K-TR be preferred over a through-hole 0.100-inch pitch socket in a high-density design?
At 0.050-inch pitch, the SFM-137-02-ZZ-D-A-K-TR provides roughly 4 times the contact density per unit length compared to a standard 0.100-inch through-hole strip. This lets designers route 74 signals across less than 2 inches of connector length, saving significant PCB area in compact modules such as SBCs, rugged compute blades, and test interposers.
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