SFM-137-02-SM-D SAMTEC Connector (Other) In Stock
SAMTEC SFM-137-02-SM-D is a 74-position dual-row surface-mount socket strip with 0.050" (1.27 mm) pitch. Features high reliability contacts with gold plating and compact SMT footprint suitable for high-density PCB designs. Available from authorized distributors worldwide.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- SFM-137-02-SM-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 74-position dual-row configuration on 0.050" (1.27 mm) pitch for high-density signal routing
- Surface-mount (SMT) termination style eliminates through-hole drilling and enables automated PCB assembly
- High-reliability gold-plated contacts ensure low contact resistance and long-term connection stability
Applications
The SFM-137-02-SM-D is widely used in high-density board-to-board and mezzanine interconnect applications where compact pitch and reliable SMT attachment are required. It suits telecommunications equipment, data storage backplanes, and industrial control cards that demand 74 signal connections in a minimal PCB footprint. Its surface-mount design is compatible with standard reflow soldering processes, simplifying manufacturing for high-volume production.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch and row configuration of the SFM-137-02-SM-D connector?
The SFM-137-02-SM-D features a 0.050" (1.27 mm) pitch dual-row layout providing 74 total positions. This compact 1.27 mm pitch allows high-density signal routing in space-constrained PCB designs while maintaining reliable SMT solder joint integrity across all 74 contacts.
Which PCB assembly process is compatible with the SFM-137-02-SM-D, and what soldering temperature does it support?
The SFM-137-02-SM-D uses surface-mount termination compatible with standard reflow soldering processes up to 260°C peak temperature. Its SMT pads allow placement by automated pick-and-place equipment, making it suitable for high-volume manufacturing lines without the need for through-hole drilling or wave soldering.
In what applications is the SFM-137-02-SM-D a strong fit compared to larger-pitch connectors?
With 74 positions on a 1.27 mm pitch dual-row footprint, the SFM-137-02-SM-D excels in mezzanine board stacking, high-speed data backplanes, and compact industrial control cards where board space is limited. Larger-pitch connectors require significantly more PCB area to achieve equivalent signal counts, making the 1.27 mm pitch SFM series the preferred choice for space-critical designs.
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