SFM-137-02-S-D-DS SAMTEC Connector (Other) In Stock
SAMTEC SFM-137-02-S-D-DS is a 74-position dual-row high-reliability socket strip with 1.27mm pitch in a surface-mount package, providing dense and reliable mezzanine board-to-board socket interconnection for demanding electronic systems.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- SFM-137-02-S-D-DS Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-137-02-S-D-DS?
- 74 positions in a dual-row 1.27mm pitch surface-mount socket enabling ultra-compact high-I/O board connections
- High-reliability contact construction rated for extended mating cycles with consistent low contact resistance
- DS (dual segment) contact design providing dual-point wiping action for enhanced connection reliability
What is SFM-137-02-S-D-DS used for?
The SFM-137-02-S-D-DS is designed for high-density mezzanine interconnects in embedded processor modules, FPGA daughter boards, and ruggedized military or medical electronics where 74 signals must be transferred reliably across a 1.27mm pitch socket. Its dual-segment contact design ensures a redundant wiping wipe that clears surface contamination on each insertion, maintaining stable electrical performance over many mating cycles. The surface-mount configuration streamlines assembly by eliminating through-hole drilling, making it well-suited to high-layer-count PCBs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-137-02-S-D-DS datasheet?
SFM-137-02-S-D-DS Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-137-02-S-D-DS?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the DS (dual segment) contact design in the SFM-137-02-S-D-DS add over standard single-contact sockets?
The dual-segment (DS) contact in the SFM-137-02-S-D-DS creates two independent wiping points per pin rather than one; this dual-point wipe clears oxide films and contamination on the mating pin, resulting in contact resistance typically below 20 milliohms even after repeated insertions, which is especially critical in the 74-position array where a single high-resistance contact can corrupt an entire data bus.
How does the SFM-137-02-S-D-DS's 1.27mm pitch benefit FPGA daughter board design compared to a 2.54mm connector?
At 1.27mm pitch the SFM-137-02-S-D-DS packs 74 contacts into roughly the same linear footprint a 2.54mm connector would need for 37 contacts, allowing FPGA daughter boards to break out full 72-bit DDR data buses plus clocks within a small mezzanine area; this roughly doubles achievable I/O density and leaves room for bypass capacitors and power planes that would otherwise be crowded out.
In ruggedized or medical applications, what mating-cycle lifetime should designers expect from the SFM-137-02-S-D-DS?
SAMTEC high-reliability SFM-series connectors are typically rated for a minimum of 100 mating cycles; for a medical diagnostic module replaced annually, 100 cycles translates to at least 100 years of field service, essentially eliminating connector wear as a failure mode and satisfying IEC 60601 and similar standards' requirements for reliable separable interconnects in life-critical equipment.
Can the SFM-137-02-S-D-DS be used without tape-and-reel packaging, and when is that appropriate?
The SFM-137-02-S-D-DS is offered in tray or strip packaging options without the TR suffix, which suits prototype quantities or low-volume production where manual placement or semi-automated tooling is used; for volumes below roughly 500 units per month, tray packaging avoids the minimum reel quantity commitment while still providing the same 74-position high-reliability connector in a convenient array format for benchtop assembly.
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